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公开(公告)号：US20150163958A1
公开(公告)日：2015-06-11
申请号：US14407257
申请日：2013-06-06
Applicant: KANEKA CORPORATION
Inventor： Keisuke Oguma , Aki Koukami , Kazuo Hagiwara
CPC classification number: H05K7/2039 , B29C73/02 , C08L33/00 , C08L71/02 , H01L23/295 , H01L23/3121 , H01L23/3737 , H01L23/42 , H01L23/552 , H01L25/0655 , H01L2924/0002 , H01L2924/16151 , H01L2924/16251 , H01L2924/166 , H01L2924/3025 , H05K7/20463 , H05K9/0024 , H01L2924/00
Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.
Abstract translation: 本发明提供一种散热结构，其不会引起电子部件的接触不良等问题，适用于高密度的电子部件。 本发明还提供一种易于修复电子设备的方法。 通过在其上安装有热密度为0.2W / cm 2至500W / cm 2的电子部件的基板上的电磁屏蔽壳体中填充和固化导热性固化性树脂组合物，获得散热结构， 在23℃下的粘度为30Pa·s〜3000Pa·s，导热率为0.5W /（m·K）的含有固化型液态树脂（I）和导热性填料（II）的树脂组合物， 或更多，并且可通过水分或热量固化。
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公开(公告)号：US09826623B2
公开(公告)日：2017-11-21
申请号：US14893255
申请日：2013-12-12
Applicant: KANEKA CORPORATION
Inventor： Aki Koukami , Kazuo Hagiwara , Keisuke Oguma , Kazuhide Fujimoto
CPC classification number: H05K1/0209 , H01L23/295 , H01L23/3121 , H01L23/3737 , H01L2924/0002 , H05K1/18 , H05K3/284 , H05K2201/0104 , H05K2201/06 , H05K2201/10371 , H05K2201/10545 , H05K2203/1327 , H01L2924/00
Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.
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公开(公告)号：US10356946B2
公开(公告)日：2019-07-16
申请号：US14407257
申请日：2013-06-06
Applicant: KANEKA CORPORATION
Inventor： Keisuke Oguma , Aki Koukami , Kazuo Hagiwara
IPC: C08L71/02 , C08L33/00 , H01L23/42 , H05K7/20 , H05K9/00 , H01L23/31 , H01L23/373 , H01L23/552 , B29C73/02 , H01L23/29 , H01L25/065
Abstract: The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm2 to 500 W/cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W/(m·K) or more, and being curable by moisture or heat.
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公开(公告)号：US20170090532A1
公开(公告)日：2017-03-30
申请号：US15125339
申请日：2015-03-06
Applicant: Kaneka Corporation
Inventor： Aki Koukami , Koichi Nishiura , Takeshi Nakagaki
CPC classification number: G06F1/203 , G06F1/1656 , H01L2924/0002 , H05K1/0203 , H05K1/181 , H05K3/284 , H05K3/285 , H05K7/20409 , H05K7/20463 , H05K9/0024 , H05K2201/10371 , H05K2203/1316 , H05K2203/1322 , H01L2924/00
Abstract: The electronic terminal equipment comprising an electronic substrate on which a heat-generating electronic component is mounted and an electromagnetic shield member attached in proximity to the heat-generating electronic component, the electronic substrate being filled with a cured product of a thermally-conductive curable liquid resin between the electromagnetic shield member and the electronic substrate, and a thermally-conductive film being disposed in contact with an upper surface of the electromagnetic shield member or facing the upper surface thereof so as to diffuse heat that came up through the cured thermally-conductive curable liquid resin.
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