公开(公告)号：US20170090532A1

公开(公告)日：2017-03-30

申请号：US15125339

申请日：2015-03-06

Applicant: Kaneka Corporation

Inventor： Aki Koukami ,  Koichi Nishiura ,  Takeshi Nakagaki

IPC: G06F1/20 ,  H05K3/28 ,  H05K1/18 ,  H05K1/02 ,  H05K9/00 ,  H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1656 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/284 ,  H05K3/285 ,  H05K7/20409 ,  H05K7/20463 ,  H05K9/0024 ,  H05K2201/10371 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

Abstract: The electronic terminal equipment comprising an electronic substrate on which a heat-generating electronic component is mounted and an electromagnetic shield member attached in proximity to the heat-generating electronic component, the electronic substrate being filled with a cured product of a thermally-conductive curable liquid resin between the electromagnetic shield member and the electronic substrate, and a thermally-conductive film being disposed in contact with an upper surface of the electromagnetic shield member or facing the upper surface thereof so as to diffuse heat that came up through the cured thermally-conductive curable liquid resin.