公开(公告)号：US09826623B2

公开(公告)日：2017-11-21

申请号：US14893255

申请日：2013-12-12

Applicant: KANEKA CORPORATION

Inventor： Aki Koukami ,  Kazuo Hagiwara ,  Keisuke Oguma ,  Kazuhide Fujimoto

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/29 ,  H01L23/373 ,  H05K3/28 ,  H05K1/18 ,  H01L23/31

CPC classification number: H05K1/0209 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/06 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.