公开(公告)号：US20240019248A1

公开(公告)日：2024-01-18

申请号：US18175238

申请日：2023-02-27

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hiroki HIRAGA ,  Yasushi TOMIZAWA ,  Kengo UCHIDA ,  Kei MASUNISHI ,  Fumito MIYAZAKI ,  Ryunosuke GANDO ,  Shiori KAJI ,  Etsuji OGAWA ,  Daiki ONO

IPC: G01C19/5769 ,  G01C19/5733

CPC classification number: G01C19/5769 ,  G01C19/5733

Abstract: According to one embodiment, a sensor includes a base body including a first face, a first support portion, a first movable portion, and a first insulating member. The first face includes a first base region, a second base region, and a third base region. The first support portion is fixed to the third base region. The first movable portion is supported by the first support portion. The first movable portion includes a first movable region and a second movable region. A first gap is provided between the first base region and the first movable region. The first insulating member is fixed to the second base region, and located between the second base region and the second movable region in a first direction from the third base region to the first support portion. A second gap is provided between the first insulating member and the second movable region.

公开(公告)号：US20240085181A1

公开(公告)日：2024-03-14

申请号：US18174551

申请日：2023-02-24

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kei MASUNISHI ,  Etsuji OGAWA ,  Yasushi TOMIZAWA ,  Fumito MIYAZAKI ,  Daki ONO ,  Kengo UCHIDA ,  Hiroki HIRAGA ,  Shiori KAJI ,  Hideaki MURASE

IPC: G01C19/5656 ,  G01C19/5663

CPC classification number: G01C19/5656 ,  G01C19/5663

Abstract: According to one embodiment, a sensor includes a base, a first support portion fixed to the substrate, and a first member supported by the first support portion. A gap is provided between the base and the first member. The first beam electrode and the second beam electrode satisfy at least one of a first condition, a second condition, a third condition, a fourth condition, a fifth condition, a sixth condition, a seventh condition, or an eighth condition.

公开(公告)号：US20230288202A1

公开(公告)日：2023-09-14

申请号：US17822856

申请日：2022-08-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kei MASUNISHI ,  Yasushi TOMIZAWA ,  Etsuji OGAWA ,  Ryunosuke GANDO ,  Shiori KAJI ,  Hiroki HIRAGA ,  Fumito MIYAZAKI ,  Daiki ONO ,  Kengo UCHIDA

IPC: G01C19/5712

CPC classification number: G01C19/5712

Abstract: According to one embodiment, a sensor includes a first detection element, and a controller. The first detection element includes a base body, a first support portion, a first movable member, a first detection electrode, and a first counter detection electrode. The first support portion is fixed to the base body. The first movable member is supported by the first support portion. The first detection electrode and the first counter detection electrodes are fixed to the base body. The first movable member includes a first movable portion. The first movable portion includes a first beam, a first conductive extending portion, and a first connecting portion. The first conductive extending portion includes a first extending portion, a first extending other portion, and a first extending intermediate. The first extending portion is between the first detection electrode and the first counter detection electrodes. The controller includes a first differential circuit.

公开(公告)号：US20240085451A1

公开(公告)日：2024-03-14

申请号：US18175242

申请日：2023-02-27

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kei MASUNISHI ,  Etsuji OGAWA ,  Yasushi TOMIZAWA ,  Fumito MIYAZAKI ,  Daki ONO ,  Kengo UCHIDA ,  Hiroki HIRAGA ,  Shiori KAJI ,  Hideaki MURASE

IPC: G01P15/097 ,  G01P15/18

CPC classification number: G01P15/097 ,  G01P15/18

Abstract: According to one embodiment, a sensor includes a base body, a support portion fixed to the base body, and a first member supported by the support portion. A gap is provided between the base body and a part of the first member. The first member includes a supported region, a first movable region, a first structure, a first support structure, a first connection structure, a first connect portion, and a first beam. The support portion is located between the base body and the supported region in a first direction from the base body to the support portion. The first beam extends along a second direction crossing the first direction. A first beam position of the first beam is located between a first movable region position of the first movable region and a support portion position of the support portion in the second direction.

公开(公告)号：US20160351503A1

公开(公告)日：2016-12-01

申请号：US15061659

申请日：2016-03-04

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Ippei KUME ,  Kengo UCHIDA

IPC: H01L23/538 ,  H01L21/306 ,  H01L21/768

CPC classification number: H01L23/5384 ,  H01L21/3081 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/11

Abstract: A semiconductor device includes a semiconductor substrate provided with a through-hole, a device layer including a lower layer wiring, an insulating layer that covers the device layer, a first through-electrode that passes through the insulating layer, a first insulating film provided with an opening having a diameter that is substantially the same as or greater than an opening diameter of the through-hole of the semiconductor substrate, a second insulating film positioned on an upper side of the first insulating film and on an inner side surface of the through-hole of the semiconductor substrate, and a second through-electrode electrically connected to the lower layer wiring in the device layer from an upper side of the second insulating film through the inside of the through-hole of the semiconductor substrate.

Abstract translation: 半导体器件包括设置有通孔的半导体衬底，包括下层布线的器件层，覆盖器件层的绝缘层，穿过绝缘层的第一贯通电极，设置有绝缘层的第一绝缘膜 具有与所述半导体基板的通孔的开口直径大致相同或比其大的直径的开口，位于所述第一绝缘膜的上侧的第二绝缘膜和所述贯通孔的内侧面 并且第二贯通电极通过半导体衬底的通孔的内部从第二绝缘膜的上侧与器件层中的下层布线电连接。

公开(公告)号：US20240401949A1

公开(公告)日：2024-12-05

申请号：US18424030

申请日：2024-01-26

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hideaki MURASE ,  Yasushi TOMIZAWA ,  Daiki ONO ,  Fumito MIYAZAKI ,  Kengo UCHIDA ,  Kei MASUNISHI ,  Etsuji OGAWA ,  Jumpei OGAWA ,  Fumitaka ISHIBASHI

IPC: G01C19/5769

Abstract: According to one embodiment, a sensor includes an element section. The element section includes a base, a first fixed portion, a first intermediate connect portion, a first intermediate movable member, a first connect portion, a first movable member, and a first fixed electrode. The first fixed portion is fixed to the base. The first intermediate connect portion is supported by the first fixed portion. The first intermediate movable member is connected to the first intermediate connect portion. The first connect portion is connected to the first intermediate movable member. The first movable member is supported by the first connect portion. The first movable member includes a first movable electrode. The first fixed electrode is fixed to the base and faces the first movable electrode.

公开(公告)号：US20240310404A1

公开(公告)日：2024-09-19

申请号：US18365591

申请日：2023-08-04

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kei MASUNISHI ,  Etsuji OGAWA ,  Yasushi TOMIZAWA ,  Fumito MIYAZAKI ,  Daiki ONO ,  Kengo UCHIDA ,  Jumpei OGAWA ,  Fumitaka ISHIBASHI ,  Hideaki MURASE

IPC: G01P15/08

CPC classification number: G01P15/08

Abstract: According to one embodiment, a sensor includes a first beam, a first opposing beam, a support portion, a first linking portion, and a first connecting portion. The first beam includes a first portion and a first other portion. A direction from the first portion to the first other portion is along a first direction. A second direction from the first opposing beam to the first beam crosses the first direction. The first opposing beam includes a first opposing portion and a first other opposing portion. The first linking portion is connected to the first other portion and the first other opposing portion. The first connecting portion is connected to the first linking portion. A first connecting portion width along the second direction of the first connecting portion is narrower than a first linking portion width along the second direction of the first linking portion.

公开(公告)号：US20230288445A1

公开(公告)日：2023-09-14

申请号：US17823054

申请日：2022-08-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kei MASUNISHI ,  Yasushi TOMIZAWA ,  Etsuji OGAWA ,  Ryunosuke GANDO ,  Shiori KAJI ,  Hiroki HIRAGA ,  Fumito MIYAZAKI ,  Daiki ONO ,  Kengo UCHIDA

IPC: G01P15/093

CPC classification number: G01P15/093 ,  G01P2015/0865

Abstract: According to one embodiment, a sensor includes a stage, a driver, and a detector. The stage includes a first portion and a second portion. The driver is configured to rotate the stage. A rotation axis of the stage passes through the first portion and is along a first direction. A second direction from the first portion to the second portion crosses the first direction. The second portion is configured to rotate along a circumferential direction with the rotation axis as a center when the stage rotating. The detector is provided at the second portion. The detector includes a first detection element configured to detect a first acceleration including a component along the second direction, and a second detection element configured to detect a second acceleration including a component along the first direction.

公开(公告)号：US20150262913A1

公开(公告)日：2015-09-17

申请号：US14484400

申请日：2014-09-12

Applicant: Kabushiki Kaisha Toshiba

Inventor： Satoshi WAKATSUKI ,  Atsuko SAKATA ,  Kengo UCHIDA ,  Kazuyuki HIGASHI ,  Mitsuyoshi ENDO

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03002 ,  H01L2224/0345 ,  H01L2224/05541 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13009 ,  H01L2224/13011 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14181 ,  H01L2224/94 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/1403

Abstract: A semiconductor device including a semiconductor substrate having a first surface and a second surface, the first surface being configured for formation of a semiconductor element; a through hole extending through the semiconductor substrate; and a through electrode disposed in the through hole. The through electrode includes an insulating film disposed along a sidewall of the through hole, a conductive layer comprising a first material disposed along the insulating film, and an electrode layer comprising a second material filled inside the through hole over the conductive layer. The first material is softer than the second material. The second material has a melting point higher than a melting point of the first material. The electrode layer includes a void portion being closed near the second surface of the semiconductor substrate.

Abstract translation: 一种半导体器件，包括具有第一表面和第二表面的半导体衬底，所述第一表面被配置为形成半导体元件; 穿过所述半导体衬底的通孔; 以及设置在通孔中的贯通电极。 贯通电极包括沿着通孔的侧壁设置的绝缘膜，包括沿着绝缘膜设置的第一材料的导电层和包含填充在导电层上方的通孔内的第二材料的电极层。 第一种材料比第二种材料柔软。 第二材料的熔点高于第一材料的熔点。 电极层包括在半导体衬底的第二表面附近封闭的空隙部分。

公开(公告)号：US20240288270A1

公开(公告)日：2024-08-29

申请号：US18455115

申请日：2023-08-24

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Fumito MIYAZAKI ,  Yasushi TOMIZAWA ,  Daiki ONO ,  Hideaki MURASE ,  Kengo UCHIDA

IPC: G01C19/5712

CPC classification number: G01C19/5712

Abstract: According to one embodiment, a sensor includes a fixed member, a movable member, a first counter electrode, a second counter electrode, a first resistance element, a second resistance element, and a control device. The control device includes a controller. The controller performs a first correction operation in a state where the movable member does not receive an external force. In the first correction operation, the controller causes the movable member to generate a first vibration. In the first correction operation, the controller derives a first correction value based on a first detection result of a first component and a second detection result of a second component. The first correction value includes at least one of a first resistance correction value, a second resistance correction value, a first voltage correction value, or a second voltage correction value such that the movable member vibrates along the first direction.