Boron nitride-boron nitride composites
    3.
    发明授权
    Boron nitride-boron nitride composites 失效
    氮化硼 - 氮化硼复合材料

    公开(公告)号:US4075276A

    公开(公告)日:1978-02-21

    申请号:US446452

    申请日:1974-02-27

    摘要: Boron nitride-boron nitride composite bodies may be produced by combining pure boron nitride fibers with partially nitrided fibers consisting essentially of B, N, O, and H, and hot pressing the composite at elevated temperatures and pressure. The partially nitrided material serves as a source of matrix material for the boron nitride fibers, and when fiber orientation is properly controlled, bodies of extremely high strength may be obtained. Densities in excess of 1.5 g./cc. may be obtained, in a one-step process which overcomes difficulties inherent in multiple-step nitriding and re-nitriding processes.

    摘要翻译: 可以通过将纯氮化硼纤维与基本上由B,N,O和H组成的部分氮化纤维组合,并在高温和高压下热压复合材料来制备氮化硼 - 氮化硼复合体。 部分氮化的材料用作氮化硼纤维的基质材料源,并且当纤维取向被适当地控制时,可以获得极高强度的物体。 密度超过1.5 g./cc。 可以克服多步氮化和再氮化过程中固有的困难的一步法。

    Composition, coated article and method of coating
    6.
    发明授权
    Composition, coated article and method of coating 失效
    组合物,涂层制品和涂层方法

    公开(公告)号:US4690962A

    公开(公告)日:1987-09-01

    申请号:US835083

    申请日:1986-04-07

    摘要: An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein D is ##STR2## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR3## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein x is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer wtih the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.

    摘要翻译: 一种电子电路,其具有形成在基板上的导电图案,并且在所述基板的至少一个表面上具有由下式的可溶性可聚合低聚物获得的膜:其中D是图像,其中M 其中R是烷基或芳族基团;其中R是烷基或芳基; 其中Ar是芳基; 其中x是大于2但小于30的整数,z是零或整数,y是y和z之和等于x的整数; 并且其中n是1至10的整数。通过将上述组合物施加到基材上然后通过进一步聚合硬化组合物来涂覆基材。 优选的组合物含有上述低聚物和某些增塑剂和/或增韧剂。

    Process for coating a substrate with polyimide
    8.
    发明授权
    Process for coating a substrate with polyimide 失效
    用聚酰亚胺涂覆基材的方法

    公开(公告)号:US4467000A

    公开(公告)日:1984-08-21

    申请号:US480164

    申请日:1983-03-29

    摘要: A process for coating a substrate to provide good planarization and good mechanical and thermal stability, the process comprising applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and the ester being formed from an aromatic tetracarboxylic acid and an alcohol, and by reacting said oligomer and said ester in situ, with the process being characterized in that the ester reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40.degree. C. and 140.degree. C., and continues to react to form a cyclic imide.

    摘要翻译: 一种用于涂覆基材以提供良好的平坦化和良好的机械和热稳定性的方法,该方法包括将由氨基二胺和芳族二酐形成的低聚物施加到底物上的氨基封端的低聚物和酯, 酯由芳族四羧酸和醇形成,并通过使所述低聚物和所述酯原位反应,其特征在于酯与低聚物的胺基反应以在温度下形成高分子量聚酰胺 在40℃至140℃之间,并继续反应形成环状酰亚胺。