RF and/or RF Identification Tag/Device Having an Integrated Interposer, and Methods for Making and Using the Same
    1.
    发明申请
    RF and/or RF Identification Tag/Device Having an Integrated Interposer, and Methods for Making and Using the Same 有权
    RF和/或RF识别标签/具有集成插件的设备,以及制造和使用它们的方法

    公开(公告)号:US20120176226A1

    公开(公告)日:2012-07-12

    申请号:US13428668

    申请日:2012-03-23

    Abstract: A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag includes an interposer, an antenna/inductor, and integrated circuitry on the interposer. The integrated circuitry has a lowest layer in physical contact with the interposer. The method of manufacture includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer. The method of use includes causing/inducing a current in the present tag sufficient for it to generate, reflect or modulate a detectable electromagnetic signal, detecting the signal, and optionally, processing information conveyed by the detectable electromagnetic signal.

    Abstract translation: MOS射频监视和/或识别标签及其制造和使用的方法。 该标签在插入器上包括插入器,天线/电感器和集成电路。 集成电路具有与内插器物理接触的最低层。 制造方法包括在插入器上形成集成电路的最下层,在集成电路的最低层上形成集成电路的连续层,以及将导电功能层附着到插入器上。 或者,可以由附接到插入件的功能层形成导电结构。 使用的方法包括引起/感应当前标签中的电流,足以产生,反射或调制可检测电磁信号,检测信号,以及可选地处理由可检测电磁信号传送的信息。

    Methods for Manufacturing RFID Tags and Structures Formed Therefrom
    3.
    发明申请
    Methods for Manufacturing RFID Tags and Structures Formed Therefrom 审中-公开
    制造RFID标签和结构的方法

    公开(公告)号:US20160035762A1

    公开(公告)日:2016-02-04

    申请号:US14847999

    申请日:2015-09-08

    Abstract: Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.

    Abstract translation: 射频识别(RFID)标签及其制造方法。 RFID设备通常包括(1)金属天线和/或电感器; (2)其上的介电层,用于支撑和绝缘来自金属天线和/或电感器的集成电路; (3)介电层上的多个二极管和多个晶体管,二极管具有至少一个与晶体管共同的层; 和(4)与金属天线和/或电感器以及至少一些二极管电连通的多个电容器,所述多个电容器具有与所述多个二极管共同的至少一个层和/或与所述多个二极管的触点 二极管和晶体管。 该方法优选将液态含硅油墨沉积物集成到用于制造RFID电路的成本有效的集成制造工艺中。 此外,与包含有机电子器件的标签相比,本发明的RFID标签通常提供更高的性能(例如,改进的电气特性)。

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