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公开(公告)号：US10132999B2
公开(公告)日：2018-11-20
申请号：US15198053
申请日：2016-06-30
Applicant: International Business Machines Corporation
Inventor： Tymon Barwicz , William M. J. Green , Jens Hofrichter , Marwan H. Khater , Jessie C. Rosenberg
Abstract: Embodiments are directed to a method of forming an optical coupler system. The method includes forming at least one waveguide over a substrate, and forming a sacrificial optical coupler in a first region over the substrate. The method further includes configuring the sacrificial optical coupler to couple optical signals to or from the at least one waveguide, and forming a v-groove in the first region over the substrate, wherein forming the v-groove includes removing the sacrificial optical coupler from the first region.
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公开(公告)号：US10088697B2
公开(公告)日：2018-10-02
申请号：US14645568
申请日：2015-03-12
Applicant: International Business Machines Corporation
Inventor： Douglas M. Gill , Jonathan E. Proesel , Jessie C. Rosenberg
Abstract: A dual-use thermal and electro-optic modulator. A thermal adjustment hardware set and an electric-field adjustment hardware set adjust the thermal and electrostatic properties of a common waveguide area. The hardware sets are electrically coupled. Signals for each type of modulation are conducted to the waveguide through a shared portion of a communication medium.
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公开(公告)号：US10026852B2
公开(公告)日：2018-07-17
申请号：US15463189
申请日：2017-03-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Solomon Assefa , Tymon Barwicz , William M. Green , Marwan H. Khater , Jessie C. Rosenberg , Steven M. Shank
IPC: H01L21/02 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L31/02 , H01L31/153 , G02B6/42
Abstract: Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.
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公开(公告)号：US20140268113A1
公开(公告)日：2014-09-18
申请号：US13836054
申请日：2013-03-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Solomon Assefa , Douglas M. Gill , Jessie C. Rosenberg
CPC classification number: G01N21/9501 , G01M11/33 , G01M11/35 , G01N21/00 , G01N21/8806 , G01N2201/088 , G02B6/2813 , G02B6/30 , G02F2001/217 , G02F2201/58 , G09G3/006 , H01L22/12 , H01L31/00
Abstract: A method of determining a parameter of a wafer is disclosed. Light is propagated through a waveguide disposed in the wafer. A first measurement of optical power is obtained at a first optical tap coupled to the waveguide and a second measurement of optical power is obtained at a second optical tap coupled to the waveguide using a photodetector placed at a selected location with respect to the wafer. A difference in optical power is determined between the first optical tap and the second optical tap from the first measurement and the second measurement. The parameter of the wafer is determined from the determined difference in optical power.
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公开(公告)号：US10895682B1
公开(公告)日：2021-01-19
申请号：US16518131
申请日：2019-07-22
Applicant: International Business Machines Corporation
Inventor： Tymon Barwicz , Douglas M. Gill , William M. Green , Jason S. Orcutt , Jessie C. Rosenberg , Eugen Schenfeld , Chi Xiong
Abstract: Photonic circuits are disclosed having an efficient optical power distribution network. Laser chips (InP) having different wavelengths are flip-chip assembled near the center of a silicon photonic chip. Each InP die has multiple optical lanes, but a given die has only one wavelength. Waveguides formed in the photonic chip are optically connected to the lanes, and fan out to form multiple waveguide sets, where each waveguide set has one of the waveguides from each of the different wavelengths, i.e., one waveguide from each InP die. The waveguide network is optimized to minimize the number of crossings that any given waveguide may have, and no waveguide having a particular wavelength crosses another waveguide of the same wavelength. The unique arrangements of light sources and waveguides allows the use of a smaller number of more intense laser sources, particularly in applications such as performance-optimized datacenters where liquid cooling systems may be leveraged.
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Patent Agency Ranking
公开(公告)号：US20180275344A1
公开(公告)日：2018-09-27
申请号：US15992381
申请日：2018-05-30
Applicant: International Business Machines Corporation
Inventor： Tymon Barwicz , William M.J. Green , Jens Hofrichter , Marwan H. Khater , Jessie C. Rosenberg
CPC classification number: G02B6/136 , G02B6/305 , G02B6/34 , G02B6/423 , G02B2006/12061 , G02B2006/12107
Abstract: Embodiments are directed to a method of forming an optical coupler system. The method includes forming at least one waveguide over a substrate, and forming a sacrificial optical coupler in a first region over the substrate. The method further includes configuring the sacrificial optical coupler to couple optical signals to or from the at least one waveguide, and forming a v-groove in the first region over the substrate, wherein forming the v-groove includes removing the sacrificial optical coupler from the first region.
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公开(公告)号：US20160266414A1
公开(公告)日：2016-09-15
申请号：US14645568
申请日：2015-03-12
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Douglas M. Gill , Jonathan E. Proesel , Jessie C. Rosenberg
CPC classification number: G02F1/011 , G02F1/0147 , G02F1/025
Abstract: A dual-use thermal and electro-optic modulator. A thermal adjustment hardware set and an electric-field adjustment hardware set adjust the thermal and electrostatic properties of a common waveguide area. The hardware sets are electrically coupled. Signals for each type of modulation are conducted to the waveguide through a shared portion of a communication medium.
Abstract translation: 一种双用热电光调制器。 热调节硬件组和电场调整硬件组调整公共波导区域的热静电特性。 硬件组件电耦合。 通过通信介质的共享部分向波导传送每种调制类型的信号。
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公开(公告)号：US20210026066A1
公开(公告)日：2021-01-28
申请号：US16518131
申请日：2019-07-22
Applicant: International Business Machines Corporation
Inventor： Tymon Barwicz , Douglas M. Gill , William M. Green , Jason S. Orcutt , Jessie C. Rosenberg , Eugen Schenfeld , Chi Xiong
Abstract: Photonic circuits are disclosed having an efficient optical power distribution network. Laser chips (InP) having different wavelengths are flip-chip assembled near the center of a silicon photonic chip. Each InP die has multiple optical lanes, but a given die has only one wavelength. Waveguides formed in the photonic chip are optically connected to the lanes, and fan out to form multiple waveguide sets, where each waveguide set has one of the waveguides from each of the different wavelengths, i.e., one waveguide from each InP die. The waveguide network is optimized to minimize the number of crossings that any given waveguide may have, and no waveguide having a particular wavelength crosses another waveguide of the same wavelength. The unique arrangements of light sources and waveguides allows the use of a smaller number of more intense laser sources, particularly in applications such as performance-optimized datacenters where liquid cooling systems may be leveraged.
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公开(公告)号：US10546962B2
公开(公告)日：2020-01-28
申请号：US15980014
申请日：2018-05-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Solomon Assefa , Tymon Barwicz , William M. Green , Marwan H. Khater , Jessie C. Rosenberg , Steven M. Shank
IPC: H01L21/02 , H01L31/0203 , H01L31/0216 , H01L31/18 , H01L27/144 , G02B6/12 , H01L21/3205 , H01L31/0232 , G02B6/42 , H01L31/02 , H01L31/153 , H01L21/84 , H01L49/02
Abstract: Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.
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公开(公告)号：US20160181445A1
公开(公告)日：2016-06-23
申请号：US14580564
申请日：2014-12-23
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Solomon Assefa , Tymon Barwicz , William M. Green , Marwan H. Khater , Jessie C. Rosenberg , Steven M. Shank
IPC: H01L31/0216 , H01L27/144 , H01L31/0203 , H01L31/18
CPC classification number: H01L31/0203 , G02B6/00 , G02B6/12004 , G02B6/4253 , H01L21/0217 , H01L21/02271 , H01L21/02274 , H01L21/32053 , H01L21/84 , H01L27/1443 , H01L28/20 , H01L31/02019 , H01L31/02161 , H01L31/02327 , H01L31/153 , H01L31/18 , H01L31/1808 , H01L31/186 , H01L31/1872 , Y02E10/50 , Y02P70/521
Abstract: Approaches for silicon photonics integration are provided. A method includes: forming at least one encapsulating layer over and around a photodetector; thermally crystallizing the photodetector material after the forming the at least one encapsulating layer; and after the thermally crystallizing the photodetector material, forming a conformal sealing layer on the at least one encapsulating layer and over at least one device. The conformal sealing layer is configured to seal a crack in the at least one encapsulating layer. The photodetector and the at least one device are on a same substrate. The at least one device includes a complementary metal oxide semiconductor device or a passive photonics device.
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