公开(公告)号：US20040118597A1

公开(公告)日：2004-06-24

申请号：US10329188

申请日：2002-12-23

Applicant: Intel Corporation

Inventor： Weston Roth ,  Jayne L. Mershon ,  Xang Moua ,  Jason A. Mix

IPC: H05K001/03

CPC classification number: H05K1/0234 ,  H05K1/0225 ,  H05K1/0227 ,  H05K1/023 ,  H05K1/167 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.

Abstract translation: 本发明涉及一种用于改善电路板上的平面不连续性的耦合的装置和方法。 电路板包括形成在电压参考平面上的不连续性，例如分裂，槽或切口。 导电层覆盖不连续点。 导电层具有连接到下面的参考平面的第一部分和跨越不连续部分的第二部分。 第一部分使用插槽或通孔连接到参考平面。 并且导电层具有在参考平面上延伸但保持与其断开的第三部分。 导电层可以是石墨或炭黑。

公开(公告)号：US20040119147A1

公开(公告)日：2004-06-24

申请号：US10329210

申请日：2002-12-23

Applicant: Intel Corporation

Inventor： Weston Roth ,  Damion T. Searls ,  James D. Jackson

IPC: H01L023/495

CPC classification number: H01L23/642 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/162 ,  H05K3/02 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2203/0315 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1142 ,  H01L2924/00

Abstract: The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.

Abstract translation: 本发明涉及一种用于改善相邻信号迹线之间以及平面分裂之间的交流耦合的装置和方法以及跨越电路板上的平面分裂的信号。 电路板包括相邻的导电装置和插入其间的氧化物装置。 氧化物是氧化铜，例如铜或氧化亚铜。 在一个实施例中，相邻的导电装置是相邻的电压参考平面，其间插入在导电装置之间。 氧化铜填充分流。 在另一个实施例中，相邻的导电装置是差分信号迹线。 氧化铜填充差分信号迹线之间的间隙。 与用作填料的其它常用绝缘材料相比，氧化铜是一种具有增加的介电常数的非导电材料。 增加的介电常数增加了电容，进而增加了交流耦合。