公开(公告)号：US20020108778A1

公开(公告)日：2002-08-15

申请号：US09732115

申请日：2000-12-07

Applicant: Intel Corporation

Inventor： Terrance J. Dishongh ,  James D. Jackson

IPC: H05K007/06 ,  H05K009/00

CPC classification number: H05K1/024 ,  H05K1/0216 ,  H05K1/095 ,  H05K1/112 ,  H05K1/116 ,  H05K1/167 ,  H05K3/06 ,  H05K3/108 ,  H05K3/249 ,  H05K3/429 ,  H05K2201/035

Abstract: A printed circuit board (PCB) includes metallization portions that are enshrouded with a carbon-based cladding. The carbon-based cladding reduces noise coupling between, for example, signal lines within the metallization pattern. In addition, in at least one embodiment, the carbon-based cladding is used to implement one or more electrical resistors (e.g., pull-up and/or pull-down resistors) within the PCB. The carbon-based cladding can also be used to decrease the propagation delay of the signal lines of the PCB.

Abstract translation: 印刷电路板（PCB）包括被覆盖有碳基包层的金属化部分。 碳基包层减少例如金属化图案内的信号线之间的噪声耦合。 此外，在至少一个实施例中，碳基包层用于在PCB内部实现一个或多个电阻（例如上拉和/或下拉电阻）。 碳基包层也可以用于减小PCB的信号线的传播延迟。

公开(公告)号：US20040119147A1

公开(公告)日：2004-06-24

申请号：US10329210

申请日：2002-12-23

Applicant: Intel Corporation

Inventor： Weston Roth ,  Damion T. Searls ,  James D. Jackson

IPC: H01L023/495

CPC classification number: H01L23/642 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/162 ,  H05K3/02 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2203/0315 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1142 ,  H01L2924/00

Abstract: The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.

Abstract translation: 本发明涉及一种用于改善相邻信号迹线之间以及平面分裂之间的交流耦合的装置和方法以及跨越电路板上的平面分裂的信号。 电路板包括相邻的导电装置和插入其间的氧化物装置。 氧化物是氧化铜，例如铜或氧化亚铜。 在一个实施例中，相邻的导电装置是相邻的电压参考平面，其间插入在导电装置之间。 氧化铜填充分流。 在另一个实施例中，相邻的导电装置是差分信号迹线。 氧化铜填充差分信号迹线之间的间隙。 与用作填料的其它常用绝缘材料相比，氧化铜是一种具有增加的介电常数的非导电材料。 增加的介电常数增加了电容，进而增加了交流耦合。