公开(公告)号：US20240332100A1

公开(公告)日：2024-10-03

申请号：US18193172

申请日：2023-03-30

申请人： Intel Corporation

发明人： Pratyush Mishra ,  Marcel Wall ,  Sashi Kandanur ,  Pooya Tadayon ,  Srinivas Pietambaram ,  Benjamin Duong ,  Suddhasattwa Nad

IPC分类号： H01L23/15 ,  H01F27/24 ,  H01L23/48 ,  H01L23/498 ,  H01L23/522

CPC分类号： H01L23/15 ,  H01F27/24 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/5226

摘要： Glass-integrated inductors in integrated circuit (IC) packages are disclosed. A disclosed IC package includes a glass layer having an aperture extending therethrough, and an inductor in the aperture, the inductor including a metal core extending through the aperture, the metal core electrically coupled to interconnects on opposite sides of the glass layer, and at least one of a ferrite or a magnetic alloy in the aperture and laterally surrounding the metal core.