公开(公告)号：US20190130743A1

公开(公告)日：2019-05-02

申请号：US16233922

申请日：2018-12-27

申请人： Intel Corporation

发明人： Nadine Dabby ,  Johanna Swan ,  Annie Foong ,  Karla Saur ,  Hassnaa Moustafa ,  Rita H. Wouhaybi ,  Linda Hurd ,  Rajashree Baskaran

IPC分类号： G08G1/0968 ,  H04W4/44 ,  G01C21/34 ,  G01C21/28 ,  G08G1/0962 ,  G08G1/0965

摘要： Techniques are disclosed herein for providing guidance for autonomous vehicles in areas of low network connectivity, such as rural areas. According to an embodiment, a guidance system receives a request to exchange data with a vehicle within a specified radius thereof over a wireless connection (e.g., a radio frequency protocol-based connection). The data is stored by the guidance system and is indicative of navigation information within the specified radius. The guidance system transmits the stored data to the vehicle. The guidance system also receives, from the vehicle, data indicative of navigation information for a path previously passed by the vehicle.

公开(公告)号：US10942562B2

公开(公告)日：2021-03-09

申请号：US16146454

申请日：2018-09-28

申请人： Intel Corporation

发明人： Shekoufeh Qawami ,  Nageen Himayat ,  Chaitanya Sreerama ,  Hassnaa Moustafa ,  Rita Wouhaybi ,  Linda Hurd ,  Nadine L Dabby ,  Van Le ,  Gayathri Jeganmohan ,  Ankitha Chandran

IPC分类号： G06F1/00 ,  G06F1/3296 ,  G06F1/3212 ,  G06F1/324 ,  G06T15/00 ,  G06K9/00 ,  G06N5/04 ,  G06N20/00 ,  G06F1/3234 ,  G06F1/3206

摘要： Methods and apparatus to manage operation of variable-state computing devices using artificial intelligence are disclosed. An example computing device includes a hardware platform. The example computing device also includes an artificial intelligence (AI) engine to: determine a context of the device; and adjust an operation of the hardware platform based on an expected change in the context of the device. The adjustment modifies at least one of a computational efficiency of the device, a power efficiency of the device, or a memory response time of the device.

公开(公告)号：US20190050049A1

公开(公告)日：2019-02-14

申请号：US16146454

申请日：2018-09-28

申请人： Intel Corporation

发明人： Shekoufeh Qawami ,  Nageen Himayat ,  Chaitanya Sreerama ,  Hassnaa Moustafa ,  Rita Wouhaybi ,  Linda Hurd ,  Nadine L Dabby ,  Van Le ,  Gayathri Jeganmohan ,  Ankitha Chandran

IPC分类号： G06F1/32 ,  G06N5/04 ,  G06N99/00 ,  G06K9/00 ,  G06T15/00

摘要： Methods and apparatus to manage operation of variable-state computing devices using artificial intelligence are disclosed. An example computing device includes a hardware platform. The example computing device also includes an artificial intelligence (AI) engine to: determine a context of the device; and adjust an operation of the hardware platform based on an expected change in the context of the device. The adjustment modifies at least one of a computational efficiency of the device, a power efficiency of the device, or a memory response time of the device.

公开(公告)号：US11348909B2

公开(公告)日：2022-05-31

申请号：US16146445

申请日：2018-09-28

申请人： Intel Corporation

发明人： Maruti Gupta Hyde ,  Nageen Himayat ,  Linda Hurd ,  Min Suet Lim ,  Van Le ,  Gayathri Jeganmohan ,  Ankitha Chandran

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L23/367 ,  G06N3/08 ,  G06N3/063 ,  G06N3/04 ,  G06F1/3203 ,  H01L25/10 ,  G06F1/3296 ,  G06F1/3237 ,  G06F1/324 ,  H01L25/16 ,  G06F1/20 ,  G06F1/3206 ,  G06F1/3225 ,  G06F1/3287

摘要： Methods and apparatus to implement efficient memory storage in multi-die packages are disclosed. An example multi-die package includes a multi-die stack including a first die and a second die. The second die is stacked on the first die. The multi-die package further includes a third die adjacent the multi-die stack. The multi-die package also includes a silicon-based connector to communicatively couple the multi-die stack and the third die. The silicon-based connector includes at least one of a logic circuit or a memory circuit.

公开(公告)号：US20190051642A1

公开(公告)日：2019-02-14

申请号：US16146445

申请日：2018-09-28

申请人： Intel Corporation

发明人： Maruti Gupta Hyde ,  Nageen Himayat ,  Linda Hurd ,  Min Suet Lim ,  Van Le ,  Gayathri Jeganmohan ,  Ankitha Chandran

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L23/367 ,  G06F1/32 ,  G06N3/063 ,  G06N3/04 ,  G06N3/08

摘要： Methods and apparatus to implement efficient memory storage in multi-die packages are disclosed. An example multi-die package includes a multi-die stack including a first die and a second die. The second die is stacked on the first die. The multi-die package further includes a third die adjacent the multi-die stack. The multi-die package also includes a silicon-based connector to communicatively couple the multi-die stack and the third die. The silicon-based connector includes at least one of a logic circuit or a memory circuit.

公开(公告)号：US11551551B2

公开(公告)日：2023-01-10

申请号：US16233922

申请日：2018-12-27

申请人： Intel Corporation

发明人： Nadine Dabby ,  Johanna Swan ,  Annie Foong ,  Karla Saur ,  Hassnaa Moustafa ,  Rita H. Wouhaybi ,  Linda Hurd ,  Rajashree Baskaran

IPC分类号： G08G1/0968 ,  H04W4/44 ,  G01C21/34 ,  G01C21/28 ,  G08G1/0962 ,  G08G1/0965 ,  G08G1/0967 ,  H04W4/024 ,  G08G1/09 ,  G05D1/00

摘要： Techniques are disclosed herein for providing guidance for autonomous vehicles in areas of low network connectivity, such as rural areas. According to an embodiment, a guidance system receives a request to exchange data with a vehicle within a specified radius thereof over a wireless connection (e.g., a radio frequency protocol-based connection). The data is stored by the guidance system and is indicative of navigation information within the specified radius. The guidance system transmits the stored data to the vehicle. The guidance system also receives, from the vehicle, data indicative of navigation information for a path previously passed by the vehicle.