公开(公告)号：US20230097793A1

公开(公告)日：2023-03-30

申请号：US17485331

申请日：2021-09-25

Applicant: Intel Corporation

Inventor： Travis W. Lajoie ,  Pei-hua Wang ,  Gregory J. George ,  Bernhard Sell ,  Juan G. Alzate-Vinasco ,  Chieh-Jen Ku ,  Alekhya Nimmagadda

IPC: H01L29/45 ,  H01L29/24 ,  H01L29/417 ,  H01L29/786 ,  H01L21/02 ,  H01L21/443 ,  H01L29/66 ,  H01L27/108

Abstract: Described herein are integrated circuit devices with lined interconnects. Interconnect liners can help maintain conductivity between semiconductor devices (e.g., transistors) and the interconnects that conduct current to and from the semiconductor devices. In some embodiments, metal interconnects are lined with a tungsten liner. Tungsten liners may be particularly useful with semiconductor devices that use certain channel materials, such as indium gallium zinc oxide.

公开(公告)号：US20230317615A1

公开(公告)日：2023-10-05

申请号：US17708051

申请日：2022-03-30

Applicant: Intel Corporation

Inventor： Deepyanti Taneja ,  Travis W. Lajoie ,  Abhishek Anil Sharma ,  Gregory J. George ,  Tarannum Tiasha ,  Huiying Liu ,  Yue Liu ,  Moshe Dolejsi ,  Vinaykumar V. Hadagali ,  Shardul Wadekar ,  Vladimir Nikitin ,  Albert B. Chen ,  Daniel J. Schinke ,  James O'Donnell

IPC: H01L23/532 ,  H01L27/12

CPC classification number: H01L23/53295 ,  H01L27/1248 ,  H01L27/1259 ,  H01L27/1255 ,  H01L23/5226

Abstract: An integrated circuit includes a first layer, and a second layer above the first layer. A third layer is between a first section of the first layer and a first section of the second layer. A fourth layer is laterally adjacent to the third layer, the fourth layer between a second section of the first layer and a second section of the second layer. In an example, a first dielectric material of the third layer is different (e.g., one or both of compositionally different and structurally different) from a second dielectric material of the fourth layer. In an example, the third and fourth layers are etch stop layers. In some cases, the third and fourth layers are coplanar with each other with respect to their top surfaces, or their bottom surfaces, or both their top and bottom surfaces.