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公开(公告)号:US09894752B2
公开(公告)日:2018-02-13
申请号:US14678714
申请日:2015-04-03
申请人: Intel Corporation
发明人: Zhichao Zhang , Gong Ouyang , Kai Xiao , Kemal Aygun , Beom-Taek Lee
CPC分类号: H05K1/0237 , H01F17/0013 , H01F2017/002 , H05K1/0233 , H05K1/116 , H05K1/165
摘要: Systems, apparatuses, and methods may include a circuit board having a plated through hole with a via portion and a stub portion and a self-coupled inductor electrically coupled to the via portion of the plated through hole. The self-coupled inductor may include a first inductor mutually coupled to a second inductor in series to reduce a capacitive effect of the stub portion of the plated through hole.
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公开(公告)号:US09504159B2
公开(公告)日:2016-11-22
申请号:US14169423
申请日:2014-01-31
申请人: INTEL CORPORATION
CPC分类号: H05K1/18 , H05K1/0216 , H05K1/0245 , H05K1/0251 , H05K1/115 , H05K1/144 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K2201/10734 , H05K2203/1461 , Y10T29/49165
摘要: A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB). The bridge device may include a second via of the bridge device, the second via of the bridge device having a short via stub or no via stub, the second via of the bridge device to be communicatively coupled to a second via of the PCB. A trace of the bridge device may communicatively couple the first via of the bridge device to the second via of the bridge device.
摘要翻译: 这里描述了桥接设备。 桥接器件可以包括桥接器件的第一通孔,桥接器件的第一通路具有短通孔短路或非通路短路,桥接器件的第一通孔可通信地耦合到印刷电路板的第一通孔 (PCB)。 桥接器件可以包括桥接器件的第二通孔,桥接器件的第二通孔具有短通孔短截线或没有通孔短路,桥接器件的第二通孔可通信地耦合到PCB的第二通孔。 桥接器件的迹线可以将桥接器件的第一通路通信地耦合到桥接器件的第二通孔。
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公开(公告)号:US09935036B2
公开(公告)日:2018-04-03
申请号:US15036385
申请日:2015-06-26
申请人: Intel Corporation
发明人: Gong Ouyang , Beom-Taek Lee
CPC分类号: H01L23/48 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/07 , H01L2224/04042 , H01L2224/05553 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48464 , H01L2224/48472 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2924/19107 , H01L2224/05599 , H01L2924/00012 , H01L2924/20752 , H01L2924/00 , H01L2224/85399
摘要: Some embodiments of the present disclosure describe an integrated circuit (IC) package assembly having first, second, and third insulated wires wire bonded with die pads on an IC die, with an outer surface of the second insulated wire located at a distance of less than an outer cross-sectional diameter of the second insulated wire from an outer surface of the first insulated wire at a first location and located at a distance of less than the outer cross-sectional diameter from an outer surface of the third insulated wire at a second location. Other embodiments may be described and/or claimed.
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公开(公告)号:US09924595B2
公开(公告)日:2018-03-20
申请号:US14567402
申请日:2014-12-11
申请人: Intel Corporation
CPC分类号: H05K1/115 , H01R12/585 , H01R12/718 , H01R31/06 , H05K1/147 , H05K1/184 , H05K2201/10295 , H05K2201/10356 , H05K2201/10378 , H05K2201/10545 , H05K2201/1059 , H05K2201/10704 , H05K2201/10901
摘要: In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.
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公开(公告)号:US09485854B2
公开(公告)日:2016-11-01
申请号:US14464279
申请日:2014-08-20
申请人: Intel Corporation
发明人: Shaowu Huang , Kai Xiao , Beom-Taek Lee , Boping Wu , Xiaoning Ye
IPC分类号: H05K1/02 , H01P3/08 , H01P11/00 , H05K1/09 , H05K3/30 , H05K1/18 , G06F1/16 , H01P1/26 , H01P5/16 , H04L25/03
CPC分类号: H05K1/023 , G06F1/16 , H01P1/268 , H01P3/08 , H01P5/16 , H01P11/003 , H01R12/737 , H01R13/6461 , H04L25/03006 , H05K1/0216 , H05K1/0231 , H05K1/0243 , H05K1/0246 , H05K1/0268 , H05K1/09 , H05K1/181 , H05K3/22 , H05K3/303 , H05K3/4007 , H05K2201/10159 , H05K2201/10204
摘要: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.
摘要翻译: 本公开的实施例涉及布置在印刷电路板(PCB)组件中的互连件中的电信号吸收的技术和配置。 在一种情况下,PCB组件可以包括衬底和形成在衬底中以在PCB内布置电信号的互连。 互连可以与布置在PCB的表面上的连接部件耦合。 吸收材料可以设置在PCB上以与连接部件的至少一部分直接接触,以至少部分地吸收电信号的一部分。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US20160057851A1
公开(公告)日:2016-02-25
申请号:US14464279
申请日:2014-08-20
申请人: Intel Corporation
发明人: Shaowu Huang , Kai Xiao , Beom-Taek Lee , Boping Wu , Xiaoning Ye
CPC分类号: H05K1/023 , G06F1/16 , H01P1/268 , H01P3/08 , H01P5/16 , H01P11/003 , H01R12/737 , H01R13/6461 , H04L25/03006 , H05K1/0216 , H05K1/0231 , H05K1/0243 , H05K1/0246 , H05K1/0268 , H05K1/09 , H05K1/181 , H05K3/22 , H05K3/303 , H05K3/4007 , H05K2201/10159 , H05K2201/10204
摘要: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.
摘要翻译: 本公开的实施例涉及布置在印刷电路板(PCB)组件中的互连件中的电信号吸收的技术和配置。 在一种情况下,PCB组件可以包括衬底和形成在衬底中以在PCB内布置电信号的互连。 互连可以与布置在PCB的表面上的连接部件耦合。 吸收材料可以设置在PCB上以与连接部件的至少一部分直接接触,以至少部分地吸收电信号的一部分。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US09716361B2
公开(公告)日:2017-07-25
申请号:US15291993
申请日:2016-10-12
申请人: Intel Corporation
发明人: Shaowu Huang , Beom-Taek Lee
CPC分类号: H01R33/92 , G06F1/185 , G11C5/04 , H01R12/737 , H01R25/00 , H05K1/14 , H05K1/141 , H05K7/1422 , H05K2201/10159 , H05K2201/10189
摘要: Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.
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公开(公告)号:US09679854B2
公开(公告)日:2017-06-13
申请号:US14619052
申请日:2015-02-10
申请人: Intel Corporation
发明人: Shaowu Huang , Beom-Taek Lee
CPC分类号: H01L23/5382 , G06F1/185 , H01L23/5389 , H04B3/36 , H04L25/20 , H05K1/029 , H05K1/14 , H05K1/144
摘要: The present disclosure is directed to a reconfigurable repeater system. A system may comprise a PCB to which devices are coupled. At least one communication channel may convey communications signals between the devices. At least one receptacle may also be coupled to the PCB and may intersect the at least one communication channel so as to separate the at least one communication channel into sections. Inserting at least one extender module into the at least one receptacle may couple the at least one extender module to the sections of the communication module. The at least one extender module may include at least one conductor to convey communication signals between the sections of the at least one communication channel. Another configuration of the at least one extender module may include a repeater to receive, amplify and transmit communication signals between the sections of the at least one communication channel.
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公开(公告)号:US20170006698A1
公开(公告)日:2017-01-05
申请号:US15265704
申请日:2016-09-14
申请人: Intel Corporation
发明人: Shaowu Huang , Kai Xiao , Beom-Taek Lee , Boping Wu , Xiaoning Ye
IPC分类号: H01P1/24 , H05K1/18 , H05K3/40 , H05K3/22 , H01P3/08 , H01P11/00 , H01R12/73 , H01R13/6461 , H05K1/02 , H01P1/26
CPC分类号: H05K1/023 , G06F1/16 , H01P1/268 , H01P3/08 , H01P5/16 , H01P11/003 , H01R12/737 , H01R13/6461 , H04L25/03006 , H05K1/0216 , H05K1/0231 , H05K1/0243 , H05K1/0246 , H05K1/0268 , H05K1/09 , H05K1/181 , H05K3/22 , H05K3/303 , H05K3/4007 , H05K2201/10159 , H05K2201/10204
摘要: Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.
摘要翻译: 本公开的实施例涉及布置在印刷电路板(PCB)组件中的互连件中的电信号吸收的技术和配置。 在一种情况下,PCB组件可以包括衬底和形成在衬底中以在PCB内布置电信号的互连。 互连可以与布置在PCB的表面上的连接部件耦合。 吸收材料可以设置在PCB上以与连接部件的至少一部分直接接触,以至少部分地吸收电信号的一部分。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US09496633B1
公开(公告)日:2016-11-15
申请号:US14746411
申请日:2015-06-22
申请人: Intel Corporation
发明人: Shaowu Huang , Beom-Taek Lee
CPC分类号: H01R33/92 , G06F1/185 , G11C5/04 , H01R12/737 , H01R25/00 , H05K1/14 , H05K1/141 , H05K7/1422 , H05K2201/10159 , H05K2201/10189
摘要: Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.
摘要翻译: 与双列直插存储器模块(DIMM)适配器卡相关联的设备和过程。 具体来说,DIMM适配器卡可以被配置为可移除地与印刷电路板(PCB)的槽连接。 DIMM适配器卡还可以被配置成可拆卸地与第一DIMM和第二DIMM耦合。 可以描述和/或要求保护其他实施例。
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