Three-dimensional display module
    2.
    发明授权

    公开(公告)号:US10522062B2

    公开(公告)日:2019-12-31

    申请号:US15372409

    申请日:2016-12-08

    摘要: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.

    Display panel integrated with photoelectric device
    3.
    发明授权
    Display panel integrated with photoelectric device 有权
    显示面板与光电装置集成

    公开(公告)号:US09356179B2

    公开(公告)日:2016-05-31

    申请号:US14586847

    申请日:2014-12-30

    摘要: A display panel comprising a substrate, a meshed shielding pattern, a plurality of light-emitting devices and a solar cell is provided. The substrate has a first surface and a second surface opposite to the first surface, the substrate comprises a first circuit layer disposed over the first surface and a second circuit layer disposed over the second surface. The meshed shielding pattern is disposed on first surface of the substrate to define a plurality of pixel regions over the substrate. The light-emitting devices are disposed on the first surface of the substrate and electrically connected to the first circuit layer, and at least one of the light-emitting devices is disposed in one of the pixel regions. The solar cell is disposed on the second surface of the substrate and electrically connected to the second circuit layer.

    摘要翻译: 提供了包括基板,网状屏蔽图案,多个发光装置和太阳能电池的显示面板。 衬底具有与第一表面相对的第一表面和第二表面,衬底包括设置在第一表面上的第一电路层和设置在第二表面上的第二电路层。 网状屏蔽图案设置在基板的第一表面上以在基板上限定多个像素区域。 发光装置设置在基板的第一表面上并电连接到第一电路层,并且至少一个发光装置设置在一个像素区域中。 太阳能电池设置在基板的第二表面上并电连接到第二电路层。

    TRANSFER-BONDING METHOD FOR LIGHT EMITTING DEVICES
    4.
    发明申请
    TRANSFER-BONDING METHOD FOR LIGHT EMITTING DEVICES 有权
    用于发光装置的转移粘合方法

    公开(公告)号:US20150111329A1

    公开(公告)日:2015-04-23

    申请号:US14583594

    申请日:2014-12-27

    IPC分类号: H01L33/00 H01L33/56 H01L33/62

    摘要: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.

    摘要翻译: 提供了包括以下步骤的发光器件的转印 - 粘合方法。 多个发光器件形成在第一衬底上并且被布置成阵列,其中每个发光器件包括器件层和夹在器件层和第一衬底之间的夹层。 在第一基板上形成保护层以选择性地覆盖部分发光器件,并且发光器件的其它部分被保护层覆盖。 由保护层未覆盖的器件层与第二衬底结合。 由保护层覆盖的夹层被去除,使得被保护层未覆盖的器件层的部分与第一衬底分离并且转移结合到第二衬底。

    Light emitting element and fabricating method thereof
    5.
    发明授权
    Light emitting element and fabricating method thereof 有权
    发光元件及其制造方法

    公开(公告)号:US09281451B2

    公开(公告)日:2016-03-08

    申请号:US13762395

    申请日:2013-02-08

    摘要: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.

    摘要翻译: 发光元件的制造方法。 提供基板。 多个第一凹部和多个第二凹部形成在基板上,其中每个第一凹部的体积与每个第二凹部的体积不同。 提供了多个第一发光二极管芯片和多个第二发光二极管芯片,其中每个第一发光二极管芯片的体积对应于每个第一凹部的体积,并且每个第二发光二极管芯片的体积 对应于每个第二凹部的体积。 将第一发光二极管芯片移动到基板上,使得第一发光二极管芯片进入第一凹部,并且将第二发光二极管芯片移动到基板上,使得第二发光二极管芯片进入第一凹部 。

    DISPLAY PANEL
    6.
    发明申请
    DISPLAY PANEL 有权
    显示面板

    公开(公告)号:US20150108508A1

    公开(公告)日:2015-04-23

    申请号:US14586847

    申请日:2014-12-30

    IPC分类号: H01L31/173

    摘要: A display panel comprising a substrate, a meshed shielding pattern, a plurality of light-emitting devices and a solar cell is provided. The substrate has a first surface and a second surface opposite to the first surface, the substrate comprises a first circuit layer disposed over the first surface and a second circuit layer disposed over the second surface. The meshed shielding pattern is disposed on first surface of the substrate to define a plurality of pixel regions over the substrate. The light-emitting devices are disposed on the first surface of the substrate and electrically connected to the first circuit layer, and at least one of the light-emitting devices is disposed in one of the pixel regions. The solar cell is disposed on the second surface of the substrate and electrically connected to the second circuit layer.

    摘要翻译: 提供了包括基板,网状屏蔽图案,多个发光装置和太阳能电池的显示面板。 衬底具有与第一表面相对的第一表面和第二表面,衬底包括设置在第一表面上的第一电路层和设置在第二表面上的第二电路层。 网状屏蔽图案设置在基板的第一表面上以在基板上限定多个像素区域。 发光装置设置在基板的第一表面上并电连接到第一电路层,并且至少一个发光装置设置在一个像素区域中。 太阳能电池设置在基板的第二表面上并电连接到第二电路层。

    THREE DIMENSIONAL PRINTING SYSTEM
    7.
    发明申请
    THREE DIMENSIONAL PRINTING SYSTEM 审中-公开
    三维打印系统

    公开(公告)号:US20170028647A1

    公开(公告)日:2017-02-02

    申请号:US14979585

    申请日:2015-12-28

    IPC分类号: B29C67/00

    摘要: In one exemplary embodiment, a three dimensional printing system may include a tank filled with liquid forming material, a carrier platform, an optical module disposed under the tank, and a control module is provided. The control module is electrically connected to the optical module and the carrier platform, such that the carrier platform is controlled to move in the tank, and the optical module is controlled to generate light irradiating to the liquid forming material to form a solidification layer on the carrier platform. An image position of the optical module is located in a specific position away from the bottom of the tank in the liquid forming material to form a solidification plane, the liquid forming material at the solidification plane is cured and solidified to form the solidification layer, and a plurality of solidification layers are stacked to form a three dimensional object.

    摘要翻译: 在一个示例性实施例中,三维打印系统可以包括填充有液体形成材料的容器,载体平台,设置在罐下方的光学模块,以及控制模块。 控制模块电连接到光学模块和载体平台,使得载体平台被控制为在槽中移动,并且控制光学模块以产生照射到液体形成材料的光以在其上形成凝固层 载体平台。 光学模块的图像位置位于液体形成材料中远离罐底部的特定位置,以形成凝固平面,固化平面处的液体形成材料固化并固化以形成凝固层,并且 堆叠多个凝固层以形成三维物体。

    Transfer-bonding method for light emitting devices
    8.
    发明授权
    Transfer-bonding method for light emitting devices 有权
    发光装置的转印方法

    公开(公告)号:US09306117B2

    公开(公告)日:2016-04-05

    申请号:US14583594

    申请日:2014-12-27

    摘要: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.

    摘要翻译: 提供了包括以下步骤的发光器件的转印 - 粘合方法。 多个发光器件形成在第一衬底上并且被布置成阵列,其中每个发光器件包括器件层和夹在器件层和第一衬底之间的夹层。 在第一基板上形成保护层以选择性地覆盖部分发光器件,并且发光器件的其它部分被保护层覆盖。 由保护层未覆盖的器件层与第二衬底结合。 由保护层覆盖的夹层被去除,使得被保护层未覆盖的器件层的部分与第一衬底分离并且转移结合到第二衬底。

    LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF
    9.
    发明申请
    LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF 有权
    发光元件及其制造方法

    公开(公告)号:US20130214302A1

    公开(公告)日:2013-08-22

    申请号:US13762395

    申请日:2013-02-08

    IPC分类号: H01L33/48

    摘要: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.

    摘要翻译: 发光元件的制造方法。 提供基板。 多个第一凹部和多个第二凹部形成在基板上,其中每个第一凹部的体积与每个第二凹部的体积不同。 提供了多个第一发光二极管芯片和多个第二发光二极管芯片,其中每个第一发光二极管芯片的体积对应于每个第一凹部的体积,并且每个第二发光二极管芯片的体积 对应于每个第二凹部的体积。 将第一发光二极管芯片移动到基板上,使得第一发光二极管芯片进入第一凹部,并且将第二发光二极管芯片移动到基板上,使得第二发光二极管芯片进入第一凹部 。