发明授权
- 专利标题： Light emitting element and fabricating method thereof
- 专利标题（中）： 发光元件及其制造方法
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申请号： US13762395申请日： 2013-02-08
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公开(公告)号： US09281451B2公开(公告)日： 2016-03-08
- 发明人: Wen-Yung Yeh , Kuo-Tung Tiao , Chia-Hsin Chao , Hsi-Hsuan Yen , Ming-Hsien Wu , Jui-Ying Lin , Ying-Chien Chu
- 申请人： Industrial Technology Research Institute
- 申请人地址： TW Hsinchu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsinchu
- 代理机构： Jianq Chyun IP Office
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L25/075 ; H01L23/00 ; H01L33/20 ; H01L33/60 ; F21K99/00 ; F21Y101/02 ; F21Y113/02
摘要：
A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.
公开/授权文献
- US20130214302A1 LIGHT EMITTING ELEMENT AND FABRICATING METHOD THEREOF 公开/授权日：2013-08-22
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