公开(公告)号：US20180108284A1

公开(公告)日：2018-04-19

申请号：US15372409

申请日：2016-12-08

Applicant: Industrial Technology Research Institute

Inventor： Ying-Chien Chu ,  Yen-Hsiang Fang ,  Chia-Hsin Chao ,  Ming-Hsien Wu ,  Shih-Hao Wang

IPC: G09G3/00 ,  G09G3/34 ,  G09G3/36 ,  G02F1/1343 ,  G06T19/00 ,  G02F1/137 ,  G02B27/01

CPC classification number: G09G3/003 ,  G02B27/01 ,  G02B27/0101 ,  G02B27/017 ,  G02B2027/0127 ,  G02B2027/0134 ,  G02F1/134309 ,  G02F1/137 ,  G02F1/29 ,  G02F2001/294 ,  G06T19/006 ,  G06T2219/004 ,  G09G3/3413 ,  G09G3/342 ,  G09G3/36 ,  G09G2300/0426 ,  G09G2380/10

Abstract: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.

公开(公告)号：US09306117B2

公开(公告)日：2016-04-05

申请号：US14583594

申请日：2014-12-27

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Ying-Chien Chu ,  Shih-Hao Wang ,  Yen-Hsiang Fang ,  Mu-Tao Chu

IPC: H01L21/00 ,  H01L33/00 ,  H01L27/15 ,  H01L25/075 ,  H01L33/44 ,  H01L33/58

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/44 ,  H01L33/58 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.

Abstract translation: 提供了包括以下步骤的发光器件的转印 - 粘合方法。 多个发光器件形成在第一衬底上并且被布置成阵列，其中每个发光器件包括器件层和夹在器件层和第一衬底之间的夹层。 在第一基板上形成保护层以选择性地覆盖部分发光器件，并且发光器件的其它部分被保护层覆盖。 由保护层未覆盖的器件层与第二衬底结合。 由保护层覆盖的夹层被去除，使得被保护层未覆盖的器件层的部分与第一衬底分离并且转移结合到第二衬底。

公开(公告)号：US11163121B2

公开(公告)日：2021-11-02

申请号：US16430447

申请日：2019-06-04

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Shih-Hao Wang ,  Yi-Chen Lin

IPC: H05K3/30 ,  G02B6/34 ,  G02B6/42 ,  G01J1/04 ,  G01J1/02 ,  G02B6/12 ,  G02B6/30 ,  H01S5/12 ,  H04B10/079

Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.

公开(公告)号：US10522062B2

公开(公告)日：2019-12-31

申请号：US15372409

申请日：2016-12-08

Applicant: Industrial Technology Research Institute

Inventor： Ying-Chien Chu ,  Yen-Hsiang Fang ,  Chia-Hsin Chao ,  Ming-Hsien Wu ,  Shih-Hao Wang

IPC: G09G3/00 ,  G02B27/01 ,  G02F1/1343 ,  G02F1/137 ,  G06T19/00 ,  G09G3/34 ,  G09G3/36

Abstract: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.

公开(公告)号：US20170034922A1

公开(公告)日：2017-02-02

申请号：US15222976

申请日：2016-07-29

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Shih-Hao Wang ,  Yi-Chen Lin

IPC: H05K3/30

CPC classification number: G02B6/34 ,  G01J1/0209 ,  G01J1/0407 ,  G01J1/0422 ,  G02B6/12004 ,  G02B6/305 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4298 ,  G02B2006/12121 ,  G02B2006/12147 ,  H01S5/0425 ,  H01S5/12 ,  H04B10/079 ,  H05K3/30 ,  H05K2203/0147 ,  H05K2203/163

Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.

Abstract translation: 提供了包括以下步骤的电子设备的检测方法。 检测方法包括：提供电子器件基板; 通过电子设备传送模块附接电子设备基板的电子设备的一部分，其中电子设备传送模块包括与电子设备的该部分对应的多个检测元件，并且每个检测元件包括至少一对 的电极; 检测所述至少一对电极之间的传导路径是否产生，以确认所述电子设备的所述部分与所述接触目标之间的接触状态; 以及将附接到电子设备传送模块的电子设备的部分传送到目标基板。 还提供了一种具有检测元件的电子设备传送模块。

公开(公告)号：US20190285805A1

公开(公告)日：2019-09-19

申请号：US16430447

申请日：2019-06-04

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Shih-Hao Wang ,  Yi-Chen Lin

IPC: G02B6/34 ,  G02B6/42 ,  H01S5/042 ,  H01S5/12 ,  G01J1/04 ,  G01J1/02 ,  H04B10/079 ,  H05K3/30 ,  G02B6/30 ,  G02B6/12

Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.

公开(公告)号：US20150111329A1

公开(公告)日：2015-04-23

申请号：US14583594

申请日：2014-12-27

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Ying-Chien Chu ,  Shih-Hao Wang ,  Yen-Hsiang Fang ,  Mu-Tao Chu

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/44 ,  H01L33/58 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.

Abstract translation: 提供了包括以下步骤的发光器件的转印 - 粘合方法。 多个发光器件形成在第一衬底上并且被布置成阵列，其中每个发光器件包括器件层和夹在器件层和第一衬底之间的夹层。 在第一基板上形成保护层以选择性地覆盖部分发光器件，并且发光器件的其它部分被保护层覆盖。 由保护层未覆盖的器件层与第二衬底结合。 由保护层覆盖的夹层被去除，使得被保护层未覆盖的器件层的部分与第一衬底分离并且转移结合到第二衬底。