公开(公告)号：US20250081335A1

公开(公告)日：2025-03-06

申请号：US18820222

申请日：2024-08-29

Applicant: Industrial Technology Research Institute

Inventor： Yi-Rong Lin ,  Hsiao-Fen Wei ,  Chung-Wei Wang ,  Li-Wei Yao

IPC: H05K1/02

Abstract: An electronic device includes a surface structure. The surface structure has a curved surface and includes a substrate, a first conductive line, and a first dielectric pattern. The first conductive line is disposed above the substrate. The first dielectric pattern is disposed above the first conductive line and overlaps with the first conductive line. The surface structure has a first region and a second region. The first dielectric pattern in the first region has a first average width, the first dielectric pattern in the second region has a second average width, and the first average width is different from the second average width.

公开(公告)号：US20240164008A1

公开(公告)日：2024-05-16

申请号：US18506151

申请日：2023-11-10

Applicant: Industrial Technology Research Institute

Inventor： Li-Wei Yao ,  Hsiao-Fen Wei ,  Chung-Wei Wang ,  Shu-Wei Kuo

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/367 ,  H01L25/075 ,  H01L33/52 ,  H01L33/64 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H01L23/367 ,  H01L24/05 ,  H01L24/16 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/642 ,  H01L33/644 ,  H05K1/181 ,  H01L33/62 ,  H01L2224/05553 ,  H01L2224/16054 ,  H01L2224/16227

Abstract: A molded electronic assembly including a circuit substrate, a plurality of electronic devices, and at least one patterned heat dissipation structure is provided. The circuit substrate includes a substrate and a circuit, where the substrate has a top surface, and the circuit has a plurality of signal contacts distributed on the top surface. The electronic devices are disposed on the circuit substrate, and each of the electronic devices has a plurality of device pins connected to the signal contacts. The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate.

公开(公告)号：US20250073752A1

公开(公告)日：2025-03-06

申请号：US18818608

申请日：2024-08-29

Applicant: Industrial Technology Research Institute

Inventor： Chen-Tsai Yang ,  Chih-Cheng Cheng ,  Wan-Hsin Chen ,  Chien-Hsun Chu ,  Li-Wei Yao

IPC: B06B1/06 ,  G08B6/00

Abstract: A multi-tactile feedback component is suitable for an electronic device and includes a thin film deformation element, a thin film vibration element, and a power module. The thin film deformation element has first and second elastic layers and a gain layer disposed therebetween and forming a channel to accommodate a fluid. The thin film vibration element is connected to the thin film deformation element and has a piezoelectric layer and tactile structures. The tactile structures are disposed at a side surface of the piezoelectric layer. The power module is coupled to the thin film deformation element and the thin film vibration element. When the power module supplies an electrical energy to the thin film deformation element, the first elastic layer is deformed to push the fluid and the second elastic layer. When the power module supplies the electrical energy to the thin film vibration element, the piezoelectric layer vibrates.

公开(公告)号：US20220338309A1

公开(公告)日：2022-10-20

申请号：US17707974

申请日：2022-03-30

Applicant: Industrial Technology Research Institute

Inventor： Li-Wei Yao ,  Min-Hsiung Liang ,  Hsiao-Fen Wei ,  Yu-Pei Chang ,  Te-Hsun Lin ,  Chih-Chia Chang ,  Yen-Shu Lee

IPC: H05B3/84

Abstract: A transparent film heater is provided, including a transparent conductive film, at least two main electrodes and at least four multiple electrodes. The transparent conductive film is disposed on a transparent substrate. At least two main electrodes are arranged on two sides of the transparent conductive film along an edge of the transparent conductive film. The at least four multiple electrodes are composed of a first pair of multiple electrodes and a second pair of multiple electrodes, and are arranged on the transparent conductive film. A first spacing region and a second spacing region are respectively located between adjacent end points of the two main electrodes along the edge of the transparent conductive film. The first pair of multiple electrodes are arranged in the first spacing region, and the second pair of multiple electrodes are arranged in the second spacing region.