-
公开(公告)号：US11900217B2
公开(公告)日：2024-02-13
申请号：US18055435
申请日：2022-11-15
摘要： A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.
-
2.发明授权公开(公告)号：US11621467B2
公开(公告)日：2023-04-04
申请号：US17129364
申请日：2020-12-21
摘要： A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).
-
3.发明申请公开(公告)号：US20230055578A1
公开(公告)日：2023-02-23
申请号：US18048470
申请日：2022-10-21
发明人： Nicholas Torleiv Bronn , Daniela Florentina Bogorin , Patryk Gumann , Sean Hart , Salvatore Bernardo Olivadese
摘要： A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
-
公开(公告)号：US11551125B2
公开(公告)日：2023-01-10
申请号：US16281657
申请日：2019-02-21
摘要： A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.
-
公开(公告)号：US11425841B2
公开(公告)日：2022-08-23
申请号：US16561920
申请日：2019-09-05
发明人： Sean Hart , Daniela Florentina Bogorin , Nicholas Torleiv Bronn , Patryk Gumann , Salvatore Bernardo Olivadese
摘要： Devices, systems, methods, and computer-implemented methods to facilitate employing thermalizing materials in an enclosure for quantum computing devices are provided. According to an embodiment, a system can comprise a quantum computing device and an enclosure having the quantum computing device disposed within the enclosure. The system can further comprise a thermalizing material disposed within the enclosure, with the thermalizing material being adapted to thermally link a cryogenic device to the quantum computing device.
-
公开(公告)号：US20220221107A1
公开(公告)日：2022-07-14
申请号：US17144932
申请日：2021-01-08
发明人： Patryk Gumann , Valerio A. Grendanin , Sean Hart , David C. Mckay , Jerry M. Chow , David Zarsky , Gilbert Bauer
摘要： Techniques facilitating custom thermal shields for cryogenic environments are provided. In one example, a cryostat can comprise a thermal shield extending between a thermal stage and a base structure coupled to a bottom plate of an outer vacuum chamber. The thermal stage can be coupled to a top plate of the outer vacuum chamber. The thermal shield can provide access to a sample mounting surface encompassed within the thermal shield from a region external to the outer vacuum chamber via the top and bottom plates of the outer vacuum chamber.
-
公开(公告)号：US20220221106A1
公开(公告)日：2022-07-14
申请号：US17144894
申请日：2021-01-08
摘要： Techniques facilitating low thermal conductivity support systems within cryogenic environments are provided. In one example, a cryostat can comprise a support rod and a washer. The support rod can couple first and second thermal stages of the cryostat. The washer can intervene between the support rod and the first thermal stage. The washer can thermally isolate the support rod and the first thermal stage.
-
公开(公告)号：US11349060B2
公开(公告)日：2022-05-31
申请号：US16905519
申请日：2020-06-18
摘要： A device includes a first substrate formed of a first material that exhibits a threshold level of thermal conductivity. The threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, the device also includes a second substrate disposed in a recess of the first substrate, the second substrate formed of a second material that exhibits a second threshold level of thermal conductivity. The second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, at least one qubit is disposed on the second substrate. In an embodiment, the device also includes a transmission line configured to carry a microwave signal between the first substrate and the second substrate.
-
公开(公告)号：US20210151575A1
公开(公告)日：2021-05-20
申请号：US16688386
申请日：2019-11-19
发明人： Steven J. Holmes , Devendra K. Sadana , Sean Hart , Patryk Gumann , Stephen W. Bedell , Ning Li
摘要： Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a suspended Majorana fermion device comprising an ion implant defined nanorod in a semiconducting device are provided. According to an embodiment, a quantum computing device can comprise a Majorana fermion device coupled to an ion implanted region. The quantum computing device can further comprise an encapsulation film coupled to the ion implanted region and a substrate layer. The encapsulation film suspends the Majorana fermion device in the quantum computing device.
-
公开(公告)号：US10903541B2
公开(公告)日：2021-01-26
申请号：US16787846
申请日：2020-02-11
发明人： Baleegh Abdo , Patryk Gumann
摘要： A hybrid microwave attenuator is constructed by forming a circuit and a housing. The circuit has two ports, a resistive component configured to attenuate some frequencies in an input signal (transmitted signal), and a dispersive component configured to attenuate some frequencies within a frequency range. The resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit. The housing includes a closable structure in which the circuit is positioned, the structure being formed of a material that exhibits at least a threshold level of thermal conductivity, where the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The housing further includes a pair of microwave connectors, the pair of connectors being thermally coupled to the housing.
-
-
-
-
-
-
-
-
-
搜索结果
132 条记录 (耗时 0.03 秒)
