公开(公告)号：US10752744B2

公开(公告)日：2020-08-25

申请号：US15856514

申请日：2017-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ,  ITEQ CORPORATION

Inventor： Feng-Po Tseng ,  Wen-Pin Ting ,  Kuo-Chan Chiou

IPC: C08J5/24 ,  C08G61/10 ,  C08K5/25 ,  C08K5/14 ,  C08K5/17 ,  C08K5/23 ,  B32B33/00 ,  C08F212/34 ,  C09D4/00 ,  C08F220/20 ,  C08L29/10 ,  C08K5/00 ,  C08K5/5415 ,  H05K1/05 ,  C08K5/3492

Abstract: A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(═O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.