公开(公告)号：US10416114B2

公开(公告)日：2019-09-17

申请号：US15352242

申请日：2016-11-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jui-Chin Chen ,  Pei-Jer Tzeng ,  Tzu-Kun Ku ,  Yu-Chen Hsin ,  Yiu-Hsiang Chang

IPC: G01N27/403 ,  G01N27/417 ,  G01N33/483 ,  G01N33/487 ,  G01N27/27 ,  G01N27/327

Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.

公开(公告)号：US10983087B2

公开(公告)日：2021-04-20

申请号：US16534427

申请日：2019-08-07

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jui-Chin Chen ,  Pei-Jer Tzeng

IPC: G01N27/327 ,  G01N27/403 ,  G01N27/417 ,  G01N33/487 ,  G01N27/406 ,  G01N33/483

Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.

公开(公告)号：US10908113B2

公开(公告)日：2021-02-02

申请号：US16197372

申请日：2018-11-21

Applicant: Industrial Technology Research Institute

Inventor： Jui-Chin Chen ,  Wen Wang ,  Pei-Jer Tzeng

IPC: G01N27/40 ,  G01N27/30 ,  G01N27/416 ,  G01N27/413 ,  G01N27/407 ,  H01L21/3213

Abstract: A liquid-sensing apparatus includes a substrate, partitions, and independent sensors. The partitions are disposed on the substrate for separating several housing spaces in order to respectively house a to-be-detected liquid, wherein each of the housing spaces has a bottom, a closed sidewall, and an open top, and thus the to-be-detected liquid may be dripped from the top of the housing space. The independent sensors are respectively formed at the bottom of different housing spaces, wherein the independent sensors respectively include different sensing material layers, and surfaces of the different sensing material layers have nanoholes.

公开(公告)号：US20140175655A1

公开(公告)日：2014-06-26

申请号：US13911075

申请日：2013-06-06

Applicant: Industrial Technology Research Institute

Inventor： Jui-Chin Chen ,  Cha-Hsin Lin ,  Tzu-Kun Ku

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L21/7684 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/03614 ,  H01L2224/03616 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05541 ,  H01L2224/05547 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05647 ,  H01L2224/0807 ,  H01L2224/08146 ,  H01L2224/08147 ,  H01L2224/08148 ,  H01L2224/11845 ,  H01L2224/1191 ,  H01L2224/16145 ,  H01L2224/80097 ,  H01L2224/80345 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/81203 ,  H01L2224/81895 ,  H01L2924/00014

Abstract: A chip bonding structure at least includes a first substrate, a second substrate opposite to the first substrate, and a copper bonding structure sandwiched in between the first and the second substrates. A Cu—Cu bonding interface is within the copper bonding structure and is characterized with combinations of protrusions and recesses, and the copper crystallization orientation at one side of the Cu—Cu bonding interface is different from that at another side.

Abstract translation: 芯片接合结构至少包括第一基板，与第一基板相对的第二基板和夹在第一和第二基板之间的铜接合结构。 Cu-Cu键合界面在铜结合结构内，其特征在于突起和凹陷的组合，Cu-Cu键合界面一侧的铜结晶取向与另一侧不同。