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    Method for Implementing High-Precision Backdrilling Stub Length Control
    3.
    发明申请
    Method for Implementing High-Precision Backdrilling Stub Length Control 有权
    高精度回钻桩长度控制方法

    公开(公告)号：US20150078848A1

    公开(公告)日：2015-03-19

    申请号：US14553942

    申请日：2014-11-25

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Yongxing Yang ,  Jian Zhang ,  Shandang Liu

    IPC: H05K3/42 ,  B23B49/00 ,  B23B41/00

    CPC classification number: B23B49/00 ,  B23B41/00 ,  B23B2228/36 ,  B23B2228/41 ,  B23B2260/128 ,  B23B2270/32 ,  B23B2270/48 ,  H05K3/429 ,  H05K2203/0207 ,  H05K2203/163 ,  Y10T408/03 ,  Y10T408/173

    Abstract: The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.

    Abstract translation: 本发明涉及一种PCB钻孔方法，包括：从初始位置执行钻孔运动，以及当与PCB的第一导电层接触时产生第一电信号，根据第一电信号确定第一导电位置 并且获得在钻穿所述第一导电层之后继续进行钻孔运动的第一Z坐标信息，以及当与第二导电层接触时产生第二电信号，根据所述第二电信号确定第二导电位置， 并获得第二Z坐标信息; 继续执行钻孔运动，并通过PCB钻孔获得通孔; 并且根据预设深度在通孔的位置执行回钻，并且预设深度是第二导电层和第一导电层之间的中等厚度加上补偿深度。

    Method for displaying image in photographing scenario and electronic device
    5.
    发明授权
    Method for displaying image in photographing scenario and electronic device 有权

    公开(公告)号：US11223772B2

    公开(公告)日：2022-01-11

    申请号：US17285818

    申请日：2018-10-15

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yuanyou Li ,  Bin Hu ,  Yongxing Yang ,  Wei Luo

    IPC: H04N5/232 ,  H04N5/76 ,  H04N9/04

    Abstract: Disclosed herein is a method for generating an image using an electronic device having a color camera, comprising: activating the color camera and a camera application on the electronic device; displaying, through the camera application, a preview image generated by the color camera; determining, automatically, whether the preview image includes an image of a first object; displaying, through the camera application in response to a determination that the preview image includes the image of the first object, a first image generated by the color camera, the first image including a color region corresponding to the first object and a gray scale region corresponding to objects that are not the first object; and displaying, through the camera application in response to a determine that the preview image does not include any image of the first object, a second image generated by the color camera, the second image is a grayscale image.

    Printed circuit board method
    6.
    发明授权
    Printed circuit board method 有权
    印刷电路板方法

    公开(公告)号：US09526178B2

    公开(公告)日：2016-12-20

    申请号：US14519677

    申请日：2014-10-21

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yongxing Yang ,  Feng Gao ,  Mingli Huang

    IPC: H05K3/42 ,  H05K3/00

    CPC classification number: H05K3/0047 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2203/0207 ,  Y10T29/49156

    Abstract: A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

    Abstract translation: 公开了一种印刷电路板（PCB）回钻方法，其中将导电层设置在电镀通孔（PTH）的预期的后向钻孔侧的PCB的表面与PCB的目标信号层之间，以及 该方法包括：以从PCB的表面开始的第一预设深度在PTH上执行第一次回钻; 控制回钻头沿着形成在第一反向钻削中的钻孔朝向目标信号层移动; 并且当所述反钻头与所述导电层接触时，从所述导电层开始以第二预设深度完成第二次回钻。

    PCB BACKDRILLING METHOD AND SYSTEM
    7.
    发明申请
    PCB BACKDRILLING METHOD AND SYSTEM 有权
    PCB背投方法和系统

    公开(公告)号：US20150047892A1

    公开(公告)日：2015-02-19

    申请号：US14519677

    申请日：2014-10-21

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： Yongxing Yang ,  Feng Gao ,  Mingli Huang

    IPC: H05K3/00 ,  H05K3/42 ,  H05K1/11

    CPC classification number: H05K3/0047 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2203/0207 ,  Y10T29/49156

    Abstract: A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

    Abstract translation: 公开了一种印刷电路板（PCB）回钻方法，其中将导电层设置在电镀通孔（PTH）的预期的后向钻孔侧的PCB的表面与PCB的目标信号层之间，以及 该方法包括：以从PCB的表面开始的第一预设深度在PTH上执行第一次回钻; 控制回钻头沿着形成在第一反向钻削中的钻孔朝向目标信号层移动; 并且当所述反钻头与所述导电层接触时，从所述导电层开始以第二预设深度完成第二次回钻。

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