公开(公告)号：US09827616B2

公开(公告)日：2017-11-28

申请号：US14553942

申请日：2014-11-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongxing Yang ,  Jian Zhang ,  Shandang Liu

IPC: B23B35/00 ,  B23B49/00 ,  B23B41/00 ,  H05K3/42

CPC classification number: B23B49/00 ,  B23B41/00 ,  B23B2228/36 ,  B23B2228/41 ,  B23B2260/128 ,  B23B2270/32 ,  B23B2270/48 ,  H05K3/429 ,  H05K2203/0207 ,  H05K2203/163 ,  Y10T408/03 ,  Y10T408/173

Abstract: The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.

公开(公告)号：US09426902B2

公开(公告)日：2016-08-23

申请号：US14081569

申请日：2013-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shandang Liu

IPC: H05K3/04 ,  H05K3/42 ,  B23B49/00 ,  B23B35/00 ,  B23B41/14 ,  H05K3/00

CPC classification number: H05K3/42 ,  B23B35/00 ,  B23B41/14 ,  B23B49/00 ,  B23B2226/27 ,  B23B2251/426 ,  H05K3/0047 ,  H05K2203/0207 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T408/03 ,  Y10T408/05

Abstract: The present invention relates to a method for drilling a printed circuit board, comprising: drilling down in an initial position, and when contacting a live superficial conductive layer of a PCB, acquiring a first conductive position and acquiring a first height difference between the initial position and the first conductive position; drilling onward after the first drill bit of the driller drills through the superficial conductive layer and when contacting another conductive layer of the PCB, acquiring a second conductive position and acquiring a second height difference between the initial position and the second conductive position; calculating a difference between the second and the first height difference to obtain a third height difference; and performing back-drilling, according to the third height difference, in a position that needs back-drilling. The present invention acquires precise depth information through a test blind via and reduces Stub length of back-drilling.

Abstract translation: 本发明涉及一种用于钻孔印刷电路板的方法，包括：在初始位置向下钻取，并且当接触PCB的活的表面导电层时，获取第一导电位置并获取初始位置之间的第一高度差 和第一导电位置; 在钻头的第一钻头穿过表面导电层之后并且当接触PCB的另一导电层时，向后钻孔，获取第二导电位置并获取初始位置和第二导电位置之间的第二高度差; 计算第二高度差和第一高度差之间的差以获得第三高度差; 并且根据第三高差来执行需要回钻的位置的回钻。 本发明通过测试盲孔获取精确的深度信息，并且减少了后钻的桩长度。

公开(公告)号：US20150078848A1

公开(公告)日：2015-03-19

申请号：US14553942

申请日：2014-11-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yongxing Yang ,  Jian Zhang ,  Shandang Liu

IPC: H05K3/42 ,  B23B49/00 ,  B23B41/00

CPC classification number: B23B49/00 ,  B23B41/00 ,  B23B2228/36 ,  B23B2228/41 ,  B23B2260/128 ,  B23B2270/32 ,  B23B2270/48 ,  H05K3/429 ,  H05K2203/0207 ,  H05K2203/163 ,  Y10T408/03 ,  Y10T408/173

Abstract: The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.

Abstract translation: 本发明涉及一种PCB钻孔方法，包括：从初始位置执行钻孔运动，以及当与PCB的第一导电层接触时产生第一电信号，根据第一电信号确定第一导电位置 并且获得在钻穿所述第一导电层之后继续进行钻孔运动的第一Z坐标信息，以及当与第二导电层接触时产生第二电信号，根据所述第二电信号确定第二导电位置， 并获得第二Z坐标信息; 继续执行钻孔运动，并通过PCB钻孔获得通孔; 并且根据预设深度在通孔的位置执行回钻，并且预设深度是第二导电层和第一导电层之间的中等厚度加上补偿深度。

公开(公告)号：US20140093321A1

公开(公告)日：2014-04-03

申请号：US14081569

申请日：2013-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shandang Liu

IPC: H05K3/42 ,  B23B49/00

CPC classification number: H05K3/42 ,  B23B35/00 ,  B23B41/14 ,  B23B49/00 ,  B23B2226/27 ,  B23B2251/426 ,  H05K3/0047 ,  H05K2203/0207 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T408/03 ,  Y10T408/05

Abstract: The present invention relates to a method for drilling a printed circuit board, comprising: drilling down in an initial position, and when contacting a live superficial conductive layer of a PCB, acquiring a first conductive position and acquiring a first height difference between the initial position and the first conductive position; drilling onward after the first drill bit of the driller drills through the superficial conductive layer and when contacting another conductive layer of the PCB, acquiring a second conductive position and acquiring a second height difference between the initial position and the second conductive position; calculating a difference between the second and the first height difference to obtain a third height difference; and performing back-drilling, according to the third height difference, in a position that needs back-drilling. The present invention acquires precise depth information through a test blind via and reduces Stub length of back-drilling.

Abstract translation: 本发明涉及一种用于钻孔印刷电路板的方法，包括：在初始位置向下钻取，并且当接触PCB的活的表面导电层时，获取第一导电位置并获取初始位置之间的第一高度差 和第一导电位置; 在钻头的第一钻头穿过表面导电层之后并且当接触PCB的另一导电层时，向后钻孔，获取第二导电位置并获取初始位置和第二导电位置之间的第二高度差; 计算第二高度差和第一高度差之间的差以获得第三高度差; 并且根据第三高差来执行需要回钻的位置的回钻。 本发明通过测试盲孔获取精确的深度信息，并且减少了后钻的桩长度。