公开(公告)号：US09510449B2

公开(公告)日：2016-11-29

申请号：US14457433

申请日：2014-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingli Huang ,  Tao Feng ,  Songlin Li

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/14 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract translation: 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。

公开(公告)号：US20220131510A1

公开(公告)日：2022-04-28

申请号：US17570575

申请日：2022-01-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaomin Zhang ,  Mingli Huang ,  Ran Jiang

IPC: H03F3/24 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

Abstract: A packaging structure and a power amplifier, the packaging structure including a first component, a second component, a printed circuit board, and a metal plate having an etched pattern. The printed circuit board is disposed on the metal plate, and the printed circuit board has an open slot. The first component is disposed in the open slot, and the first component is disposed on the metal plate. The first component is connected to the printed circuit board, the second component is disposed on the printed circuit board, and the second component is connected to the printed circuit board.

公开(公告)号：US20140345932A1

公开(公告)日：2014-11-27

申请号：US14457433

申请日：2014-08-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Mingli Huang ,  Tao Feng ,  Songlin Li

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract translation: 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。

公开(公告)号：US09526178B2

公开(公告)日：2016-12-20

申请号：US14519677

申请日：2014-10-21

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongxing Yang ,  Feng Gao ,  Mingli Huang

IPC: H05K3/42 ,  H05K3/00

CPC classification number: H05K3/0047 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2203/0207 ,  Y10T29/49156

Abstract: A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

Abstract translation: 公开了一种印刷电路板（PCB）回钻方法，其中将导电层设置在电镀通孔（PTH）的预期的后向钻孔侧的PCB的表面与PCB的目标信号层之间，以及 该方法包括：以从PCB的表面开始的第一预设深度在PTH上执行第一次回钻; 控制回钻头沿着形成在第一反向钻削中的钻孔朝向目标信号层移动; 并且当所述反钻头与所述导电层接触时，从所述导电层开始以第二预设深度完成第二次回钻。

公开(公告)号：US20150047892A1

公开(公告)日：2015-02-19

申请号：US14519677

申请日：2014-10-21

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongxing Yang ,  Feng Gao ,  Mingli Huang

IPC: H05K3/00 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K3/0047 ,  H05K3/429 ,  H05K2201/09545 ,  H05K2203/0207 ,  Y10T29/49156

Abstract: A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

Abstract translation: 公开了一种印刷电路板（PCB）回钻方法，其中将导电层设置在电镀通孔（PTH）的预期的后向钻孔侧的PCB的表面与PCB的目标信号层之间，以及 该方法包括：以从PCB的表面开始的第一预设深度在PTH上执行第一次回钻; 控制回钻头沿着形成在第一反向钻削中的钻孔朝向目标信号层移动; 并且当所述反钻头与所述导电层接触时，从所述导电层开始以第二预设深度完成第二次回钻。