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公开(公告)号：US11902087B2
公开(公告)日：2024-02-13
申请号：US17361733
申请日：2021-06-29
发明人： Zhongyu Wang , Dewei Bao , Liang Zhang , Tao Feng , Zhiping Xu
IPC分类号： H04L41/0677 , H04L43/0817 , H04L45/28 , H04L45/745
CPC分类号： H04L41/0677 , H04L43/0817 , H04L45/28 , H04L45/745
摘要： In a forwarding fault location determining method, a controller receives a plurality of table search statistical results of a plurality of forwarding tables for a first service from one or more forwarders. The plurality of forwarding tables include a first forwarding table and a second forwarding table, and the first forwarding table is prior to the second forwarding table in terms of a search sequence. Subsequently, the controller determines that table search behavior of the first forwarding table for the first service is normal and table search behavior of the second forwarding table for the first service is abnormal. The controller determines, based on the determining result, that the second forwarding table is a faulty forwarding table for the first service.
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2.发明授权Multi-layer printed circuit board and method for fabricating multi-layer printed circuit board 有权多层印刷电路板及制造多层印刷电路板的方法公开(公告)号：US09510449B2
公开(公告)日：2016-11-29
申请号：US14457433
申请日：2014-08-12
发明人： Mingli Huang , Tao Feng , Songlin Li
CPC分类号： H05K1/115 , H05K1/0251 , H05K1/144 , H05K3/4046 , H05K3/4617 , H05K3/4623 , H05K3/4647 , H05K2201/10242
摘要： Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.
摘要翻译： 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。
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公开(公告)号：US20210328859A1
公开(公告)日：2021-10-21
申请号：US17361733
申请日：2021-06-29
发明人： Zhongyu Wang , Dewei Bao , Liang Zhang , Tao Feng , Zhiping Xu
IPC分类号： H04L12/24 , H04L12/703 , H04L12/26
摘要： In a forwarding fault location determining method, a controller receives a plurality of table search statistical results of a plurality of forwarding tables for a first service from one or more forwarders. The plurality of forwarding tables include a first forwarding table and a second forwarding table, and the first forwarding table is prior to the second forwarding table in terms of a search sequence. Subsequently, the controller determines that table search behavior of the first forwarding table for the first service is normal and table search behavior of the second forwarding table for the first service is abnormal. The controller determines, based on the determining result, that the second forwarding table is a faulty forwarding table for the first service.
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4.发明申请Multi-Layer Printed Circuit Board and Method for Fabricating Multi-Layer Printed Circuit Board 有权多层印刷电路板及制作多层印刷电路板的方法公开(公告)号：US20140345932A1
公开(公告)日：2014-11-27
申请号：US14457433
申请日：2014-08-12
发明人： Mingli Huang , Tao Feng , Songlin Li
CPC分类号： H05K1/115 , H05K1/0251 , H05K1/144 , H05K3/4046 , H05K3/4617 , H05K3/4623 , H05K3/4647 , H05K2201/10242
摘要： Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.
摘要翻译： 本公开的实施例涉及电子领域，特别是涉及多层印刷电路板及其制造方法。 电路板能够避免信号传输性能受镀层孔影响的问题。 多层印刷电路板包括至少两层粘合的芯板，其中电路机械部件设置在芯板上，在芯板上还设有通孔，并且金属柱嵌入在通孔中 其中金属柱的一端连接到设置在芯板上的天线馈线电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 核心板。 该方法用于制造多层印刷电路板。
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公开(公告)号：US11251624B2
公开(公告)日：2022-02-15
申请号：US17239079
申请日：2021-04-23
发明人： Jianhua Peng , Xingjie Wang , Tao Feng
摘要： An energy efficiency control method and apparatus are provided. The method, implemented by a communications device comprising a primary power supply, a secondary power supply, and a control apparatus, includes: obtaining a current load rate of the primary power supply and a load power of the secondary power supply; determining, based on the obtained current load rate and the load power, a target output voltage of the primary power supply and a target input voltage of the secondary power supply that satisfy an energy efficiency requirement of the communications device, wherein energy efficiency of the communications device is related to the energy efficiency of the primary power supply and the energy efficiency of the secondary power supply; and controlling the primary power supply to output the target output voltage, and controlling an input voltage of the secondary power supply to be the target input voltage.
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