公开(公告)号：US20210044011A1

公开(公告)日：2021-02-11

申请号：US17077745

申请日：2020-10-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Liangsheng LIU ,  Ming CHANG ,  Jiajie TANG ,  Laicun LIN ,  Heng QU ,  Hailin DONG

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q1/22

Abstract: This application provides an example package structure with an antenna in package. The example package structure includes a substrate and a chip fastened under the substrate. The antenna in package includes a first radiator. The substrate includes a core layer and a first conductor layer, where the first radiator and a first conductive block are disposed on the first conductor layer. The package structure further includes a feed network, where the chip is coupled to the feed network, and the feed network provides feeding for the antenna in package. This application further provides a communications device.

公开(公告)号：US20220336387A1

公开(公告)日：2022-10-20

申请号：US17855358

申请日：2022-06-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi ZHOU ,  Liangsheng LIU ,  Guowen LIU

IPC: H01L23/66 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42

Abstract: The invention provides a chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. According to the millimeter-wave antenna chip provided in this application, the end-fire antenna may be lifted to the upper surface of the package substrate of the chip by using stacked metal via holes of the package substrate, and a height of the end-fire antenna relative to a peripheral component may be increased by using a thickness of the package substrate.

公开(公告)号：US20210135334A1

公开(公告)日：2021-05-06

申请号：US17150365

申请日：2021-01-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi ZHOU ,  Ming CHANG ,  Hailin DONG ,  Liangsheng LIU ,  Hongcheng YIN

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q5/35 ,  H01Q1/24 ,  H01Q1/48

Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.

公开(公告)号：US20200161766A1

公开(公告)日：2020-05-21

申请号：US16685621

申请日：2019-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Liangsheng LIU ,  Xinhong LI ,  HuiLi FU

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q23/00 ,  H01Q13/10

Abstract: The disclosure discloses an antenna-in-package structure, including a first substrate and a second substrate. A first surface of the first substrate includes a first patch antenna, the second substrate is connected to a second surface of the first substrate, and the second substrate is provided with a third surface and a fourth surface. The third surface includes a second patch antenna, and a projection of the second patch antenna on the first surface at least partially overlaps the first patch antenna. A cavity is disposed between the first substrate and the second substrate, and the second patch antenna is separated from the second surface by the cavity. The fourth surface includes a radio frequency element, and the radio frequency element sends and receives a radio frequency signal by using the first patch antenna and the second patch antenna.