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公开(公告)号:US20220336387A1
公开(公告)日:2022-10-20
申请号:US17855358
申请日:2022-06-30
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Weixi ZHOU , Liangsheng LIU , Guowen LIU
Abstract: The invention provides a chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. According to the millimeter-wave antenna chip provided in this application, the end-fire antenna may be lifted to the upper surface of the package substrate of the chip by using stacked metal via holes of the package substrate, and a height of the end-fire antenna relative to a peripheral component may be increased by using a thickness of the package substrate.
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公开(公告)号:US20220399644A1
公开(公告)日:2022-12-15
申请号:US17891498
申请日:2022-08-19
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Weixi ZHOU , Xianbiao WANG , Guowen LIU
Abstract: A millimeter-wave antenna-in-package includes a substrate, and a radiation structure and a first antenna feeder that are disposed in the substrate. The first antenna feeder includes an antenna matching stub, a feeder transmission strap, and a first harmonic suppression unit. A first end of the antenna matching stub is connected to the radiation structure. The first harmonic suppression unit includes a first transmission part and a first bent part. A first end of the first bent part is connected to a first end of the first transmission part, and a second end of the first bent part and a second end of the first transmission part form a first opening. A second end of the antenna matching stub is connected to the feeder transmission strap through the first transmission part, and the feeder transmission strap extends along the first reference direction.
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公开(公告)号:US20210135334A1
公开(公告)日:2021-05-06
申请号:US17150365
申请日:2021-01-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor: Weixi ZHOU , Ming CHANG , Hailin DONG , Liangsheng LIU , Hongcheng YIN
Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.
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