公开(公告)号：US20220336387A1

公开(公告)日：2022-10-20

申请号：US17855358

申请日：2022-06-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi ZHOU ,  Liangsheng LIU ,  Guowen LIU

IPC: H01L23/66 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/42

Abstract: The invention provides a chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. According to the millimeter-wave antenna chip provided in this application, the end-fire antenna may be lifted to the upper surface of the package substrate of the chip by using stacked metal via holes of the package substrate, and a height of the end-fire antenna relative to a peripheral component may be increased by using a thickness of the package substrate.

公开(公告)号：US20220399644A1

公开(公告)日：2022-12-15

申请号：US17891498

申请日：2022-08-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi ZHOU ,  Xianbiao WANG ,  Guowen LIU

IPC: H01Q5/335 ,  H01Q13/16 ,  H01Q1/22

Abstract: A millimeter-wave antenna-in-package includes a substrate, and a radiation structure and a first antenna feeder that are disposed in the substrate. The first antenna feeder includes an antenna matching stub, a feeder transmission strap, and a first harmonic suppression unit. A first end of the antenna matching stub is connected to the radiation structure. The first harmonic suppression unit includes a first transmission part and a first bent part. A first end of the first bent part is connected to a first end of the first transmission part, and a second end of the first bent part and a second end of the first transmission part form a first opening. A second end of the antenna matching stub is connected to the feeder transmission strap through the first transmission part, and the feeder transmission strap extends along the first reference direction.

公开(公告)号：US20200350274A1

公开(公告)日：2020-11-05

申请号：US16931819

申请日：2020-07-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajie TANG ,  Guanhong YE ,  Laicun LIN ,  Guowen LIU ,  Shuai ZHENG ,  Huafeng ZHANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.