公开(公告)号：US20210044011A1

公开(公告)日：2021-02-11

申请号：US17077745

申请日：2020-10-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Liangsheng LIU ,  Ming CHANG ,  Jiajie TANG ,  Laicun LIN ,  Heng QU ,  Hailin DONG

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q1/22

Abstract: This application provides an example package structure with an antenna in package. The example package structure includes a substrate and a chip fastened under the substrate. The antenna in package includes a first radiator. The substrate includes a core layer and a first conductor layer, where the first radiator and a first conductive block are disposed on the first conductor layer. The package structure further includes a feed network, where the chip is coupled to the feed network, and the feed network provides feeding for the antenna in package. This application further provides a communications device.

公开(公告)号：US20210135334A1

公开(公告)日：2021-05-06

申请号：US17150365

申请日：2021-01-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weixi ZHOU ,  Ming CHANG ,  Hailin DONG ,  Liangsheng LIU ,  Hongcheng YIN

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q5/35 ,  H01Q1/24 ,  H01Q1/48

Abstract: Embodiments of this application disclose an integrated circuit and a terminal device, to resolve a problem that an existing dual-band antenna has a relatively small low-frequency band range and is difficult to meet use requirements. An antenna includes a bearer structure, a first radiation patch, a second radiation patch, and a radio frequency processing chip. The first radiation patch, the second radiation patch, and the radio frequency processing chip are separately placed on different layers of the bearer structure. A first feed line and a second feed line are disposed in the bearer structure. The radio frequency processing chip feeds the first radiation patch by using the first feed line. The radio frequency processing chip feeds the second radiation patch by using the second feed line.