公开(公告)号：US07977215B2

公开(公告)日：2011-07-12

申请号：US12496436

申请日：2009-07-01

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/78 ,  H01L21/46

CPC classification number: G02B6/13 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50 ,  B24B7/228 ,  B24B37/042 ,  G02B6/3688

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing to provide an optical device wafer with breakage starting points along streets on the face side of the optical device wafer; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of the optical devices; a wafer supporting step of adhering the back-side surface of the optical device wafer to a surface of a dicing tape, and peeling the protective plate adhered to the face side of the optical device wafer; and a wafer dividing step of exerting an external force on the optical device wafer so as to break up the optical device wafer along the streets along which the breakage starting points have been formed, thereby dividing the optical device wafer into the individual optical devices.

Abstract translation: 一种分割光学元件晶片的方法包括：激光束处理步骤，执行激光束处理，以向光学器件晶片提供沿着光学器件晶片的正面侧上的街道的断裂起始点; 保护板接合步骤，用粘合剂剥离光学器件晶片的表面与高度刚性的保护板的表面接合; 背面磨削步骤，其研磨所述光学器件晶片的背面，以便将所述光学器件晶片形成为所述光学器件的成品厚度; 将所述光学器件晶片的背面粘接到切割带的表面的晶片支撑步骤，以及剥离粘附到所述光学器件晶片的所述正面的所述保护板; 以及在光学器件晶片上施加外力以沿着已经形成有断裂起点的街道分裂光学器件晶片，从而将光学器件晶片分成各个光学器件的晶片分割步骤。

公开(公告)号：US20100047999A1

公开(公告)日：2010-02-25

申请号：US12500162

申请日：2009-07-09

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/78

CPC classification number: H01L21/78 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: A dividing method for an optical device wafer includes a protective plate adhering step of releasably adhering the surface of an optical device wafer to the surface of a protective plate, a reverse face grinding step of grinding the reverse face of the optical device wafer, a dicing tape sticking step of sticking the reverse face of the optical device wafer on the surface of a dicing tape, a protective plate grinding step of grinding the reverse face of the protective plate adhered to the optical device wafer stuck on the dicing tape so as to have a predetermined thickness, a laser working step of irradiating a laser beam upon the protective plate along the streets formed on the optical device wafer to carry out laser working, which forms break starting points along the streets, for the protective plate, and a wafer dividing step of applying external force to the protective plate to break the protective plate along the break starting points to break the optical device wafer along the streets thereby to divide the optical device wafer into the individual optical devices.

Abstract translation: 光学器件晶片的分割方法包括将光学器件晶片的表面可剥离地粘附到保护板的表面的保护板粘合步骤，研磨光学器件晶片的反面的反面研磨步骤，切割 将光学元件晶片的背面粘贴在切割带的表面上的胶带粘贴步骤，保护板研磨步骤，其研磨粘附在切割胶带上的光学元件晶片上的保护板的反面，从而具有 预定厚度的激光加工步骤，激光加工步骤，沿着形成在光学器件晶片上的街道将激光束照射在保护板上，以对保护板进行沿着街道形成断裂起点的激光加工，以及晶片分割 对保护板施加外力以沿断裂起点断开保护板的步骤，沿着s断开光学器件晶片 从而将光学器件晶片分成各个光学器件。

公开(公告)号：US07662700B2

公开(公告)日：2010-02-16

申请号：US12468411

申请日：2009-05-19

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/00

CPC classification number: H01L27/14683

Abstract: An optical device wafer dividing method includes a rear surface grinding step for grinding a rear surface of the optical device wafer; a dicing tape sticking step for sticking the front surface of the optical device wafer bonded with the reinforcing substrate to the front surface of a dicing tape; a laser processing step for emitting a laser beam along the streets formed on the optical device wafer from the rear surface of the reinforcing substrate to perform laser processing on the reinforcing substrate along the streets to form fracture starting points; and a wafer dividing step for applying an external force along the fracture starting points of the reinforcing substrate to fracture the reinforcing substrate along the fracture starting points to fracture the optical device wafer along the streets.

Abstract translation: 光学器件晶片分割方法包括：用于研磨光学器件晶片的后表面的后表面研磨步骤; 用于将与加强基板粘合的光学装置晶片的前表面粘附到切割带的前表面的切割胶带粘贴步骤; 激光加工步骤，用于从加强基板的后表面沿着形成在光学器件晶片上的街道发射激光束，以沿着街道对加强基板进行激光加工，以形成断裂起点; 以及晶片分离步骤，用于沿着所述加强基板的断裂起点施加外力，以沿着所述断裂起点将所述加强基板断裂，以沿着所述街道破坏所述光学器件晶片。

公开(公告)号：US20100035408A1

公开(公告)日：2010-02-11

申请号：US12496436

申请日：2009-07-01

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/304

CPC classification number: G02B6/13 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50 ,  B24B7/228 ,  B24B37/042 ,  G02B6/3688

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing to provide an optical device wafer with breakage starting points along streets on the face side of the optical device wafer; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of the optical devices; a wafer supporting step of adhering the back-side surface of the optical device wafer to a surface of a dicing tape, and peeling the protective plate adhered to the face side of the optical device wafer; and a wafer dividing step of exerting an external force on the optical device wafer so as to break up the optical device wafer along the streets along which the breakage starting points have been formed, thereby dividing the optical device wafer into the individual optical devices.

Abstract translation: 一种分割光学元件晶片的方法包括：激光束处理步骤，执行激光束处理，以向光学器件晶片提供沿着光学器件晶片的正面侧上的街道的断裂起始点; 保护板接合步骤，用粘合剂剥离光学器件晶片的表面与高度刚性的保护板的表面接合; 背面磨削步骤，其研磨所述光学器件晶片的背面，以便将所述光学器件晶片形成为所述光学器件的成品厚度; 将所述光学器件晶片的背面粘接到切割带的表面的晶片支撑步骤，以及剥离粘附到所述光学器件晶片的所述正面的所述保护板; 以及在光学器件晶片上施加外力以沿着已经形成有断裂起点的街道分裂光学器件晶片，从而将光学器件晶片分成各个光学器件的晶片分割步骤。

公开(公告)号：US08048780B2

公开(公告)日：2011-11-01

申请号：US12497877

申请日：2009-07-06

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/302

CPC classification number: H01L21/67132 ,  B23K26/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L33/0095

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing on the face side of an optical device wafer so as to form breakage starting points along streets; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of optical devices; a dicing tape adhering step of adhering the back-side surface of the optical device wafer to a dicing tape; a cut groove forming step of cutting the protective plate bonded to the optical device wafer along the streets so as to form cut grooves; and a wafer dividing step of exerting an external force on the optical device wafer through the protective plate, so as to break up the optical device wafer along the breakage starting points formed along the streets, thereby dividing the optical device wafer into the individual optical devices.

Abstract translation: 光学元件晶片的分割方法包括：激光束处理步骤，在光学元件晶片的正面进行激光束处理，形成沿着街道的断裂起点; 保护板接合步骤，用粘合剂剥离光学器件晶片的表面与高度刚性的保护板的表面接合; 背面磨削步骤，研磨光学器件晶片的背面，以便将光学器件晶片形成为光学器件的成品厚度; 切割胶带粘合步骤，将光学装置晶片的背面粘接到切割胶带上; 切割槽形成步骤，沿着街道切割与光学器件晶片接合的保护板，以形成切割槽; 以及通过保护板在光学器件晶片上施加外力的晶片分割步骤，沿着沿着街道形成的断裂起点将光学器件晶片分裂，从而将光学器件晶片分成各个光学器件 。

公开(公告)号：US07745311B2

公开(公告)日：2010-06-29

申请号：US12500162

申请日：2009-07-09

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/00

CPC classification number: H01L21/78 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336

Abstract: A dividing method for an optical device wafer includes a protective plate adhering step of releasably adhering the surface of an optical device wafer to the surface of a protective plate, a reverse face grinding step of grinding the reverse face of the optical device wafer, a dicing tape sticking step of sticking the reverse face of the optical device wafer on the surface of a dicing tape, a protective plate grinding step of grinding the reverse face of the protective plate adhered to the optical device wafer stuck on the dicing tape so as to have a predetermined thickness, a laser working step of irradiating a laser beam upon the protective plate along the streets formed on the optical device wafer to carry out laser working, which forms break starting points along the streets, for the protective plate, and a wafer dividing step of applying external force to the protective plate to break the protective plate along the break starting points to break the optical device wafer along the streets thereby to divide the optical device wafer into the individual optical devices.

Abstract translation: 光学器件晶片的分割方法包括将光学器件晶片的表面可剥离地粘附到保护板的表面的保护板粘合步骤，研磨光学器件晶片的反面的反面研磨步骤，切割 将光学元件晶片的背面粘贴在切割带的表面上的胶带粘贴步骤，保护板研磨步骤，其研磨粘附在切割胶带上的光学元件晶片上的保护板的反面，从而具有 预定厚度的激光加工步骤，激光加工步骤，沿着形成在光学器件晶片上的街道将激光束照射在保护板上，以对保护板进行沿着街道形成断裂起点的激光加工，以及晶片分割 对保护板施加外力以沿断裂起点断开保护板的步骤，沿着s断开光学器件晶片 从而将光学器件晶片分成各个光学器件。

公开(公告)号：US20100041210A1

公开(公告)日：2010-02-18

申请号：US12497877

申请日：2009-07-06

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/302

CPC classification number: H01L21/67132 ,  B23K26/40 ,  B23K2103/50 ,  H01L21/67092 ,  H01L33/0095

Abstract: A method of dividing an optical device wafer includes: a laser beam processing step of performing laser beam processing on the face side of an optical device wafer so as to form breakage starting points along streets; a protective plate bonding step of bonding the face side of the optical device wafer to a surface of a highly rigid protective plate with a bonding agent permitting peeling; a back side grinding step of grinding the back side of the optical device wafer so as to form the optical device wafer to a finished thickness of optical devices; a dicing tape adhering step of adhering the back-side surface of the optical device wafer to a dicing tape; a cut groove forming step of cutting the protective plate bonded to the optical device wafer along the streets so as to form cut grooves; and a wafer dividing step of exerting an external force on the optical device wafer through the protective plate, so as to break up the optical device wafer along the breakage starting points formed along the streets, thereby dividing the optical device wafer into the individual optical devices.

Abstract translation: 光学元件晶片的分割方法包括：激光束处理步骤，在光学元件晶片的正面进行激光束处理，形成沿着街道的断裂起点; 保护板接合步骤，用粘合剂剥离光学器件晶片的表面与高度刚性的保护板的表面接合; 背面磨削步骤，研磨光学器件晶片的背面，以便将光学器件晶片形成为光学器件的成品厚度; 切割胶带粘合步骤，将光学装置晶片的背面粘接到切割胶带上; 切割槽形成步骤，沿着街道切割与光学器件晶片接合的保护板，以形成切割槽; 以及通过保护板在光学器件晶片上施加外力的晶片分割步骤，沿着沿着街道形成的断裂起点将光学器件晶片分裂，从而将光学器件晶片分成各个光学器件 。

公开(公告)号：US20090311848A1

公开(公告)日：2009-12-17

申请号：US12468411

申请日：2009-05-19

Applicant: Hitoshi Hoshino ,  Takashi Yamaguchi

Inventor： Hitoshi Hoshino ,  Takashi Yamaguchi

IPC: H01L21/304

CPC classification number: H01L27/14683

Abstract: An optical device wafer dividing method includes a rear surface grinding step for grinding a rear surface of the optical device wafer; a dicing tape sticking step for sticking the front surface of the optical device wafer bonded with the reinforcing substrate to the front surface of a dicing tape; a laser processing step for emitting a laser beam along the streets formed on the optical device wafer from the rear surface of the reinforcing substrate to perform laser processing on the reinforcing substrate along the streets to form fracture starting points; and a wafer dividing step for applying an external force along the fracture starting points of the reinforcing substrate to fracture the reinforcing substrate along the fracture starting points to fracture the optical device wafer along the streets.

Abstract translation: 光学器件晶片分割方法包括：用于研磨光学器件晶片的后表面的后表面研磨步骤; 用于将与加强基板粘合的光学装置晶片的前表面粘附到切割带的前表面的切割胶带粘贴步骤; 激光加工步骤，用于从加强基板的后表面沿着形成在光学器件晶片上的街道发射激光束，以沿着街道对加强基板进行激光加工，以形成断裂起点; 以及晶片分离步骤，用于沿着所述加强基板的断裂起点施加外力，以沿着所述断裂起点将所述加强基板断裂，以沿着所述街道破坏所述光学器件晶片。

公开(公告)号：US09762116B2

公开(公告)日：2017-09-12

申请号：US15041515

申请日：2016-02-11

Applicant: Takashi Yamaguchi ,  Akihiro Kinoshita ,  Shinji Horio

Inventor： Takashi Yamaguchi ,  Akihiro Kinoshita ,  Shinji Horio

IPC: H02M1/32 ,  H02M3/156 ,  H02M1/00

CPC classification number: H02M1/32 ,  H02M3/156 ,  H02M2001/0048 ,  Y02B70/1491

Abstract: A voltage conversion apparatus includes a booster circuit, a boost stop circuit, a Zener diode, and a capacitor. The boost stop circuit includes a transistor. When an overvoltage equal to or larger than a breakdown voltage of the Zener diode is output to an output line of the booster circuit, the Zener diode is turned on. Accordingly, the transistor is turned on and a switching element is turned off to stop a boost operation. Further, the capacitor is charged through the Zener diode. Even when the Zener diode is turned off due to a drop in the output voltage after the stop of the boost operation, the transistor maintains its on state for a certain time by discharge of the capacitor. Thus, the stop of the boost operation is continued.

公开(公告)号：US09164245B2

公开(公告)日：2015-10-20

申请号：US13454611

申请日：2012-04-24

Applicant: Takashi Yamaguchi ,  Kazuhiro Takizawa

Inventor： Takashi Yamaguchi ,  Kazuhiro Takizawa

IPC: G02B6/255 ,  G02B6/38

CPC classification number: G02B6/3858 ,  G02B6/255 ,  G02B6/2555 ,  G02B6/2558 ,  G02B6/3846

Abstract: The present invention relates to an optical connector including, a ferrule within which an integrated optical fiber is fixed, a clamp portion disposed at a rear of the ferrule, the clamp portion comprising: a base component and a lid component facing the based component, where the base component and the lid component together are configured to clamp an end portion of the integrated optical fiber and an end portion of a naked optical fiber abutting the end portion of the integrated optical fiber, and a naked optical fiber guide portion disposed at a rear of the clamp portion, where the naked optical fiber guide portion comprises a through hole through which the naked optical fiber can be inserted, and that guides the naked optical fiber to the clamp portion by the through hole.

Abstract translation: 光连接器技术领域本发明涉及一种光连接器，其包括固定有集成光纤的套圈，设置在套圈后部的夹持部，所述夹持部包括：基部部件和面向所述基部部件的盖部件， 基部部件和盖部件一起构成为夹持集成光纤的端部和与该集成光纤的端部抵接的裸光纤的端部，以及设置在后方的裸光纤引导部 其中裸光纤引导部分包括可以插入裸光纤的通孔，并且通过通孔将裸光纤引导到夹持部分。