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公开(公告)号：US20140367702A1
公开(公告)日：2014-12-18
申请号：US14370803
申请日：2012-07-25
Applicant: Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
Inventor： Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
CPC classification number: H01L23/3672 , H01L21/4871 , H01L21/4882 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.
Abstract translation: 目的在于提供一种鳍状集成型半导体器件及其制造方法，其具有简单的结构和良好的散热特性。 半导体器件包括：在第一主面上形成有以直立状态排列的翅片的基板; 绝缘层，形成在所述基板的第二主面上，所述第二主面与所述基板的所述第一主面相对; 固定到所述绝缘层的电路图案; 以及连接到电路图案的半导体元件。 翅片形成有沿翅片的厚度方向穿过的狭缝。
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公开(公告)号：US09390995B2
公开(公告)日：2016-07-12
申请号：US14370803
申请日：2012-07-25
Applicant: Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
Inventor： Kei Yamamoto , Kazuhiro Tada , Hideki Komori , Toru Kimura , Masaki Goto , Hiroyuki Yoshihara
IPC: H01L23/367 , H01L23/34 , B23P15/26 , H01L23/433 , H01L21/48 , H01L23/31 , H01L21/56 , H01L23/373 , H01L29/16 , H01L29/20
CPC classification number: H01L23/3672 , H01L21/4871 , H01L21/4882 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L29/1602 , H01L29/1608 , H01L29/2003 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.
Abstract translation: 目的在于提供一种鳍状集成型半导体器件及其制造方法，其具有简单的结构和良好的散热特性。 半导体器件包括：在第一主面上形成有以直立状态排列的翅片的基板; 绝缘层，形成在所述基板的第二主面上，所述第二主面与所述基板的所述第一主面相对; 固定到所述绝缘层的电路图案; 以及连接到电路图案的半导体元件。 翅片形成有沿翅片的厚度方向穿过的狭缝。
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公开(公告)号：US09134076B2
公开(公告)日：2015-09-15
申请号：US13510162
申请日：2009-11-17
Applicant: Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
Inventor： Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
CPC classification number: F28F3/02 , B23P11/00 , B23P2700/10 , H01L21/4878 , H01L21/4882 , H01L23/3672 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , Y10T29/4935 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.
Abstract translation: 一种散热器，包括：多个散热片; 以及辐射翅片支撑基座，其具有安装到其一个表面的加热器元件和安装有辐射翅片的多个平行翅片槽，以及突出部，其将形成的辐射翅片固定到其另一个表面上，其中， 突起推动散热片的一个侧表面，以将散热片的另一侧表面推向散热片槽的侧表面，并且其中散热片槽和突起分别沿着 翅片槽，并且分割的翅片槽和每个分割的突起在翅片槽的纵向方向上具有相同的长度，并且彼此成对配合。
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公开(公告)号：US20120227952A1
公开(公告)日：2012-09-13
申请号：US13510162
申请日：2009-11-17
Applicant: Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
Inventor： Hiroyuki Yoshihara , Masaki Goto , Toru Kimura
CPC classification number: F28F3/02 , B23P11/00 , B23P2700/10 , H01L21/4878 , H01L21/4882 , H01L23/3672 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , Y10T29/4935 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other.
Abstract translation: 一种散热器，包括：多个散热片; 以及辐射翅片支撑基座，其具有安装到其一个表面的加热器元件和安装有辐射翅片的多个平行翅片槽，以及突出部，其将形成的辐射翅片固定到其另一个表面上，其中， 突起推动散热片的一个侧表面，以将散热片的另一侧表面推向散热片槽的侧表面，并且其中散热片槽和突起分别沿着 翅片槽，并且分割的翅片槽和每个分割的突起在翅片槽的纵向方向上具有相同的长度，并且彼此成对配合。
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公开(公告)号：US08659147B2
公开(公告)日：2014-02-25
申请号：US12988035
申请日：2009-06-04
Applicant: Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi , Yoichi Goto
Inventor： Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi , Yoichi Goto
CPC classification number: H01L23/3107 , H01L23/3672 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/48 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.
Abstract translation: 一种功率半导体电路器件及其制造方法，它们均设置有：至少安装有功率半导体元件的基板; 在基板的与安装有功率半导体元件的表面相对的基板表面露出的基板的部分表面的状态下模制基板和功率半导体元件的树脂; 以及通过按压力与基板接合的散热翅片。 在基板上形成有与散热片接合的部分的槽，散热片通过铆接而与沟槽接合。
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Patent Agency Ranking
公开(公告)号：US20110031612A1
公开(公告)日：2011-02-10
申请号：US12988035
申请日：2009-06-04
Applicant: Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi
Inventor： Takao Mitsui , Hiroyuki Yoshihara , Toru Kimura , Masao Kikuchi
CPC classification number: H01L23/3107 , H01L23/3672 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L24/48 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.
Abstract translation: 一种功率半导体电路器件及其制造方法，它们均设置有：至少安装有功率半导体元件的基板; 在基板的与安装有功率半导体元件的表面相对的基板表面露出的基板的部分表面的状态下模制基板和功率半导体元件的树脂; 以及通过按压力与基板接合的散热翅片。 在基板上形成有与散热片接合的部分的槽，散热片通过铆接而与沟槽接合。
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公开(公告)号：US11168411B2
公开(公告)日：2021-11-09
申请号：US16444148
申请日：2019-06-18
Applicant: Robert T. Bondokov , James R. Grandusky , Jianfeng Chen , Shichao Wang , Toru Kimura , Thomas Miebach , Keisuke Yamaoka , Leo J. Schowalter
Inventor： Robert T. Bondokov , James R. Grandusky , Jianfeng Chen , Shichao Wang , Toru Kimura , Thomas Miebach , Keisuke Yamaoka , Leo J. Schowalter
IPC: C30B33/02 , C30B29/40 , H01L33/32 , C30B23/06 , C01B21/072
Abstract: In various embodiments, single-crystal aluminum nitride boules and substrates are formed from the vapor phase with controlled levels of impurities such as carbon. Single-crystal aluminum nitride may be heat treated via quasi-isothermal annealing and controlled cooling to improve its ultraviolet absorption coefficient and/or Urbach energy.
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8.发明授权公开(公告)号：US09030280B2
公开(公告)日：2015-05-12
申请号：US14129807
申请日：2012-09-10
Applicant: Kazuki Takahashi , Mitsuru Tsukima , Tomoko Tanabe , Taehyun Kim , Toru Kimura
Inventor： Kazuki Takahashi , Mitsuru Tsukima , Tomoko Tanabe , Taehyun Kim , Toru Kimura
IPC: H01H67/02 , H01H1/54 , H01H33/666
CPC classification number: H01H1/54 , H01F7/1615 , H01H33/6662 , H01H51/2227 , H01H71/32
Abstract: An electromagnetically operated device includes: a moving member of the electromagnetically operated device; a drive coil that is energized to generate magnetic flux for driving the moving member; a permanent magnet provided between a stationary member and the moving member for holding the moving member; and a holding force adjusting member for adjusting the holding force applied to the moving member by the permanent magnet, wherein the holding force adjusting member is placed at a position that will not be included in the main magnetic path of the magnetic flux caused by the drive coil so as to be removable.
Abstract translation: 电磁操作装置包括：电磁操作装置的移动部件; 驱动线圈，其被通电以产生用于驱动所述移动部件的磁通量; 设置在静止构件和用于保持移动构件的移动构件之间的永磁体; 以及保持力调节构件，用于调节由永磁体施加到移动构件的保持力，其中保持力调节构件被放置在不包括在由驱动器引起的磁通量的主磁路中的位置 线圈，以便可拆卸。
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公开(公告)号：US08754730B2
公开(公告)日：2014-06-17
申请号：US13504208
申请日：2010-01-13
Applicant: Toru Kimura , Tomotaka Yano
Inventor： Toru Kimura , Tomotaka Yano
CPC classification number: H01H33/666 , H01H3/3031 , H01H3/46 , H01H31/003 , H01H33/40
Abstract: An electromagnetically operated switching device according to the present invention includes a pair of electromagnetically operated mechanisms for driving a main circuit contact of a switch via a link mechanism symmetrically arranged with respect to an operational center axis, and a length of a spring retaining plate can be regulated in accordance with a change of a link ratio, which is caused by a design change of the main circuit contact.
Abstract translation: 根据本发明的电磁开关装置包括一对电磁操作机构，用于通过相对于操作中心轴对称布置的连杆机构驱动开关的主回路接触，并且弹簧保持板的长度可以是 根据由主电路触点的设计变化引起的连接比的变化进行调节。
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公开(公告)号：US20120212307A1
公开(公告)日：2012-08-23
申请号：US13504208
申请日：2010-01-13
Applicant: Toru Kimura , Tomotaka Yano
Inventor： Toru Kimura , Tomotaka Yano
IPC: H01H3/38
CPC classification number: H01H33/666 , H01H3/3031 , H01H3/46 , H01H31/003 , H01H33/40
Abstract: An electromagnetically operated switching device according to the present invention includes a pair of electromagnetically operated mechanisms for driving a main circuit contact of a switch via a link mechanism symmetrically arranged with respect to an operational center axis, and a length of a spring retaining plate can be regulated in accordance with a change of a link ratio, which is caused by a design change of the main circuit contact.
Abstract translation: 根据本发明的电磁开关装置包括一对电磁操作机构，用于通过相对于操作中心轴对称布置的连杆机构驱动开关的主回路接触，并且弹簧保持板的长度可以是 根据由主电路触点的设计变化引起的连接比的变化进行调节。
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