摘要:
A dishwasher includes a main body being generally of a box shape with an open front, a washer tub being slidably extracted from and retracted into the main body through the open front, the washer tub having an open top, and a covering member for blocking a gap to be opened between the washer tub and the main body when the washer tub is fully extracted from the main body. Therefore, when the washer tub is fully extracted from the main body, a rear end of an inner wall of the washer tub is located in front of a front end of the main body to open the gap and the opened gap is covered by the covering member.
摘要:
A method of mounting electronic parts on the predetermined positions of a printed circuit board is disclosed which is capable of simultaneously correcting the misregistration of a plurality of electronic parts by one cycle of operations so as to precisely position and mount the electronic parts on the printed circuit board. In the present invention, the misregistration of individual electronic parts with respect to suction tubes of a suction head in an automatic chip-mounting apparatus is corrected at the time when the suction tubes suck up the electronic parts from the cavities of the jig in which the electronic parts are charged to thereby place each of the suction tubes on the predetermined or exact suction position of the electronic parts or align the center of each of the electronic parts with that of the corresponding suction tube.
摘要:
A flame retardant liquid rubber composition comprises a hydrogenated polyhydroxybutadiene polymer and castor oil, which are modified with an isocyanate having the formula ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 respectively represent a lower alkyl group or hydrogen atom and n is an integer of 1 to 4, and alumina hydrate and magnesium hydroxide. The castor oil can be incorporated before adding said isocyanate or can be converted into an isocyanate prepolymer by reacting with said isocyanate before the addition.
摘要:
Upon a selector operation of a valve such as a four-way selector valve provided in a refrigerating cycle for selecting a channel of fluid, prevention of environmental pollution and energy saving and the like are effectively achieved. A sliding valve is coupled with a piston in a housing of a channel selector valve provided in a refrigerating cycle and the sliding valve moves due to a difference in pressure and so on at both sides of the piston, thereby a channel of fluid is selected. A processing section of a control device is constituted with microcomputers of an indoor and outdoor control sections, while a detecting section of the control device includes temperature sensor, detection means for detecting pressure, detection means for detecting flow rate, detection means for detecting voltage/current, and detection means for detecting frequency. Driving sections of an electrically-driven expansion valve, an indoor heat exchanger, an outdoor heat exchanger and a compressor are means that function in response to execution of control programs so that physical quantity, such as pressure, differential pressure and flow rate in the channel selector valve provided in the refrigerating cycle, and a rate of change in physical quantity, such as a rate of change in pressure, a rate of change in differential pressure and a rate of change in flow rate, are controlled, thereby a channel of the fluid is selected by the channel selector valve.
摘要:
When a fine pattern is formed by using a chemical-amplification-type resist film, fall of acid in the surface of the resist can be inhibited so that a fine pattern exhibiting an excellent shape is formed. A resist coating film containing a compound having a sulfonic acid group or a carbonic acid group is formed on a chemical-amplification-type resist film of a semiconductor substrate, followed by performing exposure.
摘要:
The present invention relates to a light-sensitive resin composition that has resistance to heat and chemicals, is particularly adapted for use in the formation of a protective film for chemical plating and which is also improved in resistance to the heat of soldering. This light-sensitive resin composition contains (a) a polyurethane (meth)acrylate, (aa) a bisphenol type epoxy (meth)acrylate, (b) a linear high-molecular weight compound, and (c) a polymerization initiator which generates free radicals upon exposure to light. This resin composition is applicable to the manufacture of printed circuit boards by the additive process.
摘要:
A chip separation and alignment apparatus capable of accurately and readily accomplishing separation and alignment of chips with a simple construction. The apparatus includes a chip separation and alignment section and a chip separation section. The chip separation and alignment section includes a chip cassette formed into a flat rectangular box-like shape, in which are formed a chip storage chamber, a chip alignment hole provided with an upper end opening through which the chip alignment hole is communicated with a lower portion of the chip storage chamber and a lower end opening, and at least one air ejection port arranged near the upper end opening to intermittently eject air therethrough. The chip separation section is arranged at the lower end opening of the chip alignment hole to separate chips one by one and to successively supply the separated chips to a subsequent step.
摘要:
A chip separation and alignment apparatus capable of accurately and readily accomplishing separation and alignment of chips with a simple construction. The apparatus includes a chip separation and alignment section and a chip separation section. The chip separation and alignment section includes a chip cassette formed into a flat rectangular box-like shape, in which are formed a chip storage chamber, a chip alignment hole provided with an upper end opening through which the chip alignment hole is communicated with a lower portion of the chip storage chamber and a lower end opening, and at least one air ejection port arranged near the upper end opening to intermittenly eject air therethrough. The chip separation section is arranged at the lower end opening of the chip alignment hole to separate chips one by one and to successively supply the separated chips to a subsequent step.
摘要:
Method and apparatus are provided for press-fitting caps on electric parts and the like. The apparatus has a device for feeding component rods of electric parts to a rod-conveying wheel provided on its circumference with lateral equally spaced grooves for receiving the rods fed from the rod-feeding device one by one, and a cap-feeding device for feeding caps to a pair of cap-conveying wheels each provided on its circumference with lateral equally-spaced grooves for receiving the caps fed from the cap-feeding device, the cap-conveying wheels being arranged symmetrically and obliquely with respect to the rod-conveying wheel so that the lower ends thereof come in contact with the lower end of the rod-conveying wheel thereby to press-fit the caps on the rods successively, and the rod-conveying and cap-conveying wheels being rotated in synchronization with one another. The method performed using the above apparatus comprises: feeding the rods onto the lateral grooves of the rod-conveying wheel one by one, feeding the caps onto the lateral grooves of the cap-conveying wheels one by one, and press-fitting the caps on both ends of the respective rods in succession.
摘要:
First feedforward calculation is executed when a preprocessing surface profile is measured and a processing chamber with its processing parameter value having been obtained through the first feedforward calculation judged to be within an allowable range is determined. Wafer transfer is executed only in conjunction with a processing chamber having a processing parameter value judged to be within the allowable range, and the wafer is carried to the entry point of the processing chamber. Then, second feedforward calculation is executed by reflecting the results of feedback calculation executed based upon the most recent processing having been executed in the particular processing chamber and wafer processing is executed in the processing chamber based upon the processing parameter value calculated in the second feedforward calculation.