发明授权
- 专利标题： Resist coating film
- 专利标题（中）： 抗蚀涂层
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申请号： US789560申请日： 1997-01-28
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公开(公告)号： US5981146A公开(公告)日： 1999-11-09
- 发明人: Teruhiko Kumada , Atsuko Sasahara , Youko Tanaka , Hideo Horibe , Shigeru Kubota , Hiroshi Koezuka , Tetsuro Hanawa
- 申请人： Teruhiko Kumada , Atsuko Sasahara , Youko Tanaka , Hideo Horibe , Shigeru Kubota , Hiroshi Koezuka , Tetsuro Hanawa
- 申请人地址： JPX Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-132242 19920525; JPX4-294851 19921104
- 主分类号： G03F7/38
- IPC分类号： G03F7/38 ; G03F7/004 ; G03F7/09 ; G03F7/095 ; H01L21/027 ; G03C1/73
摘要：
When a fine pattern is formed by using a chemical-amplification-type resist film, fall of acid in the surface of the resist can be inhibited so that a fine pattern exhibiting an excellent shape is formed. A resist coating film containing a compound having a sulfonic acid group or a carbonic acid group is formed on a chemical-amplification-type resist film of a semiconductor substrate, followed by performing exposure.
公开/授权文献
- US5192620A Metallized composite film structure and method 公开/授权日：1993-03-09
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