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1.
公开(公告)号:US4935310A
公开(公告)日:1990-06-19
申请号:US405069
申请日:1989-09-07
申请人: Hiroshi Nakatsugawa
发明人: Hiroshi Nakatsugawa
CPC分类号: C25D3/562 , C25D5/10 , H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10S428/935 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要: A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil.
摘要翻译: 一种覆铜层压板,包括树脂基板和层压在所述基板上的铜箔,所述铜箔具有完全涂覆有基本上由电沉积形成的含磷镍层的层的树脂基板接合表面,所述基板为 与所述铜箔的所述接合表面面对面接触。
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2.
公开(公告)号:US4778571A
公开(公告)日:1988-10-18
申请号:US128816
申请日:1987-12-04
申请人: Hiroshi Nakatsugawa
发明人: Hiroshi Nakatsugawa
IPC分类号: C25D1/04
CPC分类号: C25D1/04
摘要: Disclosed is a method of making electrolytic metal foil, comprising carrying out electrolysis by filling with an electrolytic solution a space defined between a cathode drum capable of rotating on a horizontal axis and an anode provided in face of the surface of the drum, wherein the electrolytic solution is allowed to flow down from the upper part toward the lower part of the space at the flow velocity such that a gas generated in the solution during the electrolysis may virtually flow out downward in its whole quantity. Disclosed also is an apparatus for making electrolytic metal foil, comprising a cathode drum capable of rotating on a horizontal axis, an anode provided in face of the surface of the drum and provided a solution discharging outlet which allow a gas generated during the electrolysis to flow down the space between the both electrodes at the flow velocity such that the gas generated may downward flow out virtually in its whole quantity together with an electrolytic solution for metal electrodeposition.According to this invention, the resulting electrolytic foil can be of dense texture and of excellent physical properties and surface states.
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公开(公告)号:US4976826A
公开(公告)日:1990-12-11
申请号:US481434
申请日:1990-02-16
申请人: Toshio Tani , Osamu Kamiyama , Noborn Matsuki , Ryosaku Fukuda , Tsukasa Akutsu , Hiroshi Nakatsugawa
发明人: Toshio Tani , Osamu Kamiyama , Noborn Matsuki , Ryosaku Fukuda , Tsukasa Akutsu , Hiroshi Nakatsugawa
IPC分类号: C25D1/04
CPC分类号: C25D1/04
摘要: Disclosed is a method of making electrodeposited copper foil which comprises carrying electrolysis by adding a water-soluble cellulose ether to an electrolytic solution.A profile of the matte side nodules of the electrodeposited copper foil obtained by the method of the present invention can be easily controlled, and the electrodeposited copper foil which is high above IPC specification Class 3 in elongation at room temperature and high temperature can be obtained.
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4.
公开(公告)号:US4483906A
公开(公告)日:1984-11-20
申请号:US476248
申请日:1983-03-18
申请人: Hiroshi Nakatsugawa
发明人: Hiroshi Nakatsugawa
CPC分类号: C25D5/12 , C25D11/38 , H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10S428/926 , Y10S428/935 , Y10T428/12438 , Y10T428/12611 , Y10T428/1291
摘要: Copper foil for printed circuits which comprises a copper layer and a nickel layer formed on one or both sides of said copper layer, the surface of said nickel layer having been subjected to a cathodic chromic acid treatment, and a method for producing the same. Said copper foil can be etched easily and completely with ammonium persulfate solution or with a cupric chloride solution, and is free from so called undercutting phenomenon. A further advantage of printed circuits prepared with said copper foil is that the exposed resin substrate is not stained and the copper foil is strongly adhered to the substrate before and after heating.
摘要翻译: 用于印刷电路的铜箔,其包括在所述铜层的一侧或两侧上形成的铜层和镍层,所述镍层的表面经过阴极铬酸处理及其制造方法。 所述铜箔可以用过硫酸铵溶液或氯化铜溶液容易且完全地蚀刻,并且没有所谓的底切现象。 用所述铜箔制备的印刷电路的另一个优点是,暴露的树脂基板未被染色,并且铜箔在加热之前和之后都牢固地附着在基板上。
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公开(公告)号:US5262290A
公开(公告)日:1993-11-16
申请号:US870545
申请日:1992-04-17
CPC分类号: G03C1/775 , G03C7/3022
摘要: A silver halide light-sensitive material is disclosed, which has high light-sensitive speed and improved gradation and sharpness. The light-sensitive material comprises a paper substrate which has polyolefin resin layers on both sides thereof, and a silver halide emulsion layer provided on one of the polyolefin layers. The polyolefin layer on which the silver halide emulsion layer to be provided contains white pigment particles in an amount of not less than 13 weight percent of the polyolefin resin contained in the polyolefin layer, and surface of the polyolefin layer on which the emulsion layer to be provided has a di-dimensional arithmetical mean deviation of the profile, SRa, of not larger than 0.14 .mu.m, and the silver halide emulsion layer comprises at least two kinds of monodispersed silver halide emulsions each having a silver chloride content of not less than 90 mole % and being different from each other in speed.
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6.
公开(公告)号:US4386139A
公开(公告)日:1983-05-31
申请号:US202661
申请日:1980-10-31
申请人: Hiroshi Nakatsugawa
发明人: Hiroshi Nakatsugawa
CPC分类号: C25D3/565 , C25D5/48 , H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12611 , Y10T428/12792 , Y10T428/12903
摘要: Copper foil for a printed circuit, which comprises a copper layer and a vanadium-containing zinc layer formed on one side or each side of said copper layer, and a method for producing the copper foil. The bonding surface preferably contains a chromate surface.
摘要翻译: 用于印刷电路的铜箔,其包括在所述铜层的一侧或每一侧上形成的铜层和含有钒的锌层,以及所述铜箔的制造方法。 接合表面优选含有铬酸盐表面。
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公开(公告)号:US5270158A
公开(公告)日:1993-12-14
申请号:US889062
申请日:1992-05-26
CPC分类号: G03C7/30
摘要: A light-sensitive silver halide color photographic material is disclosed. The light-sensitive material comprises a support and a silver halide emulsion layer and a non-light-sensitive hydrophilic colloid layer provided on the support. The emulsion layer comprises a mixture of at least two kinds of silver halide emulsions which different from each other in sensitivity. The emulsion layer contains a magenta coupler represented by Formula II and the non-light-sensitive layer contains a compound represented by formula II: ##STR1## wherein Ar is an aryl group; Y is a hydrogen atom or a substituent capable of releasing upon reaction with the oxidation product of a color developing agent; X is a halogen atom, an alkoxy group or an alkyl group; n is an integer of 0 to 4, Xs are the same or different when n is 2 or more; R is a strait chain or branched alkyl group having 1 to 20 carbon atoms, ##STR2## wherein R.sub.1 and R.sub.2 are each a secondary tertiary alkyl group, provided the total number of carbon atoms contained in R.sub.1 and R.sub.2 are 20 or more.
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公开(公告)号:US4964965A
公开(公告)日:1990-10-23
申请号:US465516
申请日:1990-01-16
申请人: Hiroshi Nakatsugawa
发明人: Hiroshi Nakatsugawa
IPC分类号: C25D5/08
CPC分类号: C25D5/08
摘要: An insoluble electrode device comprises a box having a plurality of faces, one of which is an open face. An outlet for discharging an electrolyte solution is provided on at least one of the other faces of the box, and a porous electrode plate is mounted on the open face of the box. A liquid flow control panel is mounted behind the porous electrode plate for the interior of the box, whereby a fresh and uniform liquid flow of an electrolyte solution is provided in the space between the electrodes, and whereby a high quality electrolytic surface treatment can be achieved.
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9.
公开(公告)号:US4376154A
公开(公告)日:1983-03-08
申请号:US199497
申请日:1980-10-22
申请人: Hiroshi Nakatsugawa
发明人: Hiroshi Nakatsugawa
CPC分类号: H05K3/244 , C25D3/565 , C25D5/10 , H05K3/384 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , Y10T428/12903
摘要: A copper foil for a printed circuit comprising a copper layer having the bonding surface coated with a tin layer and having said tin layer coated with a vanadium-containing zinc layer which optionally may be given a chromic acid treatment. The invention also provides a method for producing said copper foil.
摘要翻译: 一种用于印刷电路的铜箔,包括具有涂覆有锡层的接合表面并且所述锡层涂覆有含钒锌层的铜层,其任选地可以进行铬酸处理。 本发明还提供了一种生产所述铜箔的方法。
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