-
公开(公告)号:US20170271410A1
公开(公告)日:2017-09-21
申请号:US15500049
申请日:2015-02-11
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Minxian Max Zhang , Kathryn Samuels , Jianhua Joshua Yang , R. Stanley Williams , Zhiyong Li
IPC: H01L27/24
CPC classification number: H01L27/2418 , H01L27/2409 , H01L27/2463 , H01L45/04 , H01L45/14 , H01L45/146
Abstract: Provided in one example is a nonvolatile memory crossbar array. The array includes a number of junctions formed by a number of row lines intersecting a number of column lines; and a resistive memory element in series with a selector at each of the junctions coupling between one of the row lines and one of the column lines. The selector may be a volatile switch including: a bottom electrode; an oxide layer disposed over the bottom electrode, the oxide layer including Cu2O; and a top electrode disposed over the oxide layer.
-
公开(公告)号:US20160218285A1
公开(公告)日:2016-07-28
申请号:US14914808
申请日:2013-09-05
Applicant: HEWLETT-PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Shih-Yuan Wang , Jianhua Yang , Minxian Max Zhang , Alexandre M. Bratkovski , R. Stanley Williams
IPC: H01L45/00
CPC classification number: H01L45/1253 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/145 , H01L45/146 , H01L45/148 , H01L45/1608
Abstract: A memristor structure may be provided that includes a first electrode, a second electrode, and a buffer layer disposed on the first electrode. The memristor structure may include a switching layer interposed between the second electrode and the buffer layer to form, when a voltage is applied, a filament or path that extends from the second electrode to the buffer layer and to form a Schottky-like contact or a heterojunction between the filament and the buffer layer.
Abstract translation: 可以提供一种忆阻器结构,其包括设置在第一电极上的第一电极,第二电极和缓冲层。 忆阻器结构可以包括插入在第二电极和缓冲层之间的开关层,当施加电压时,形成从第二电极延伸到缓冲层并形成肖特基状接触的长丝或路径 灯丝与缓冲层之间的异质结。
-
公开(公告)号:US10147762B2
公开(公告)日:2018-12-04
申请号:US15316762
申请日:2014-06-26
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Minxian Max Zhang , Jianhua Yang , R. Stanley Williams
Abstract: Protective elements are provided for non-volatile memory cells in crossbar arrays in which each memristor is situated at a crosspoint of the array. Each memristor is provided with a protective element. The protective element includes a layer of a first oxide that upon heating converts to a second oxide having a higher resistivity than the first oxide.
-
公开(公告)号:US20170271409A1
公开(公告)日:2017-09-21
申请号:US15329913
申请日:2015-01-29
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Jianhua Yang , Ning Ge , Katy Samuels , Minxian Max Zhang
CPC classification number: H01L27/2418 , G11C11/1659 , G11C13/0007 , G11C13/004 , G11C13/0069 , G11C2213/32 , G11C2213/34 , G11C2213/76 , H01L27/2409 , H01L27/2463 , H01L45/08 , H01L45/085 , H01L45/1233 , H01L45/1253 , H01L45/145 , H01L45/146 , H01L45/16 , H01L45/1625
Abstract: A resistive memory device includes a first electrode, a memristor coupled in electrical series with the first electrode, a second electrode coupled in electrical series with the memristor, a selector coupled in electrical series with the second electrode, and a third electrode coupled in electrical series with the selector. The memristor includes oxygen or nitrogen elements. The selector includes a composite dielectric material of a first dielectric material, a second dielectric material that is different from the first dielectric material, and a dopant material including a cation having a migration rate faster than the oxygen or the nitrogen elements of the memristor. The first dielectric material and the second dielectric material are present in a ratio ranging from 1:9 to 9:1, and a concentration of the dopant material in the composite dielectric material ranges from about 1% up to 50%.
-
公开(公告)号:US10096651B2
公开(公告)日:2018-10-09
申请号:US15329913
申请日:2015-01-29
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Jianhua Yang , Ning Ge , Katy Samuels , Minxian Max Zhang
Abstract: A resistive memory device includes a first electrode, a memristor coupled in electrical series with the first electrode, a second electrode coupled in electrical series with the memristor, a selector coupled in electrical series with the second electrode, and a third electrode coupled in electrical series with the selector. The memristor includes oxygen or nitrogen elements. The selector includes a composite dielectric material of a first dielectric material, a second dielectric material that is different from the first dielectric material, and a dopant material including a cation having a migration rate faster than the oxygen or the nitrogen elements of the memristor. The first dielectric material and the second dielectric material are present in a ratio ranging from 1:9 to 9:1, and a concentration of the dopant material in the composite dielectric material ranges from about 1% up to 50%.
-
公开(公告)号:US09793473B2
公开(公告)日:2017-10-17
申请号:US14914808
申请日:2013-09-05
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Shih-Yuan Wang , Jianhua Yang , Minxian Max Zhang , Alexandre M. Bratkovski , R. Stanley Williams
CPC classification number: H01L45/1253 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/145 , H01L45/146 , H01L45/148 , H01L45/1608
Abstract: A memristor structure may be provided that includes a first electrode, a second electrode, and a buffer layer disposed on the first electrode. The memristor structure may include a switching layer interposed between the second electrode and the buffer layer to form, when a voltage is applied, a filament or path that extends from the second electrode to the buffer layer and to form a Schottky-like contact or a heterojunction between the filament and the buffer layer.
-
7.
公开(公告)号:US20170271589A1
公开(公告)日:2017-09-21
申请号:US15329801
申请日:2015-01-26
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Minxian Max Zhang , Jianhua Yang , Zhiyong Li , R. Stanley Williams
CPC classification number: H01L45/146 , H01L27/2436 , H01L27/2463 , H01L27/2481 , H01L45/06 , H01L45/08 , H01L45/1233 , H01L45/145 , H01L45/1633 , H01L45/1641
Abstract: A resistive memory array includes a plurality of resistive memory devices. A sneak path current in the resistive memory array is reduced when a negative temperature coefficient of resistance material is incorporated in series with a negative differential resistance selector that is in series with a memristor switching material at a junction formed at a cross-point between two conductors of one of the plurality of resistive memory devices.
-
-
-
-
-
-