CHARGING PROTECTION CIRCUIT, CHARGING CIRCUIT, AND ELECTRONIC DEVICE

    公开(公告)号:US20240355811A1

    公开(公告)日:2024-10-24

    申请号:US18649658

    申请日:2024-04-29

    Abstract: This application relates to a charging protection circuit. The charging protection circuit implements overcurrent protection by using a four-terminal NMOS switching transistor. In the solution provided in this application, floating management is performed on a Sub port of the four-terminal NMOS switching transistor. Specifically, when the four-terminal NMOS switching transistor is turned on, potential of the Sub port is pulled up, to avoid an excessively large internal resistance of the four-terminal NMOS switching transistor caused by an excessively large voltage between the Sub port and a drain of the four-terminal NMOS switching transistor. In addition, this application further provides a charging circuit and an electronic device.

    Charging protection circuit, charging circuit, and electronic device

    公开(公告)号:US12002801B2

    公开(公告)日:2024-06-04

    申请号:US17852476

    申请日:2022-06-29

    Abstract: This application relates to a charging protection circuit. The charging protection circuit implements overcurrent protection by using a four-terminal NMOS switching transistor. In the solution provided in this application, floating management is performed on a Sub port of the four-terminal NMOS switching transistor. Specifically, when the four-terminal NMOS switching transistor is turned on, potential of the Sub port is pulled up, to avoid an excessively large internal resistance of the four-terminal NMOS switching transistor caused by an excessively large voltage between the Sub port and a drain of the four-terminal NMOS switching transistor. In addition, this application further provides a charging circuit and an electronic device.

    Semiconductor Device and Manufacturing Method

    公开(公告)号:US20210074853A1

    公开(公告)日:2021-03-11

    申请号:US17073967

    申请日:2020-10-19

    Inventor: Huaifeng Wang

    Abstract: A semiconductor device, a terminal device, and a manufacturing method, where the device uses a groove-gate structure and a double-longitudinal reduced surface field (RESURF) technology using a longitudinal field plate and a longitudinal PN junction, and a channel is disposed on a bottom of a groove. The device is implemented based on a conventional spit trench gate metal-oxide-semiconductor (MOS) process or a monolithic integrated bipolar-complementary MOS (CMOS)-double-diffused MOS field-effect transistor (DMOS) (BCD) process technology.

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