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公开(公告)号：US20130081944A1
公开(公告)日：2013-04-04
申请号：US13628093
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Francois-Charles Dary , Mark Gaydos , William Loewenthal , Steven Alfred Miller , Gary Rozak , Scott Jeffrey Volchko , Stefan Zimmermann , Michael Thomas Stawony
IPC: C23C14/34
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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Patent Agency Ranking
公开(公告)号：US09120183B2
公开(公告)日：2015-09-01
申请号：US13628088
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： William Loewenthal , Steven Alfred Miller
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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3.发明授权Methods of manufacturing large-area sputtering targets using interlocking joints 有权使用互锁接头制造大面积溅射靶的方法公开(公告)号：US09108273B2
公开(公告)日：2015-08-18
申请号：US13628090
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Scott Jeffrey Volchko , William Loewenthal , Stefan Zimmermann , Mark Gaydos , Steven Alfred Miller
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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公开(公告)号：US20130081748A1
公开(公告)日：2013-04-04
申请号：US13628089
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Steven Alfred Miller , Francois-Charles Dary , Mark Gaydos , Gary Rozak
IPC: B05D1/02
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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公开(公告)号：US20130082033A1
公开(公告)日：2013-04-04
申请号：US13628090
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Scott Jeffrey Volchko , William Loewenthal , Stefan Zimmermann , Mark Gaydos , Steven Alfred Miller
IPC: B23K31/02
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
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公开(公告)号：US20130081943A1
公开(公告)日：2013-04-04
申请号：US13628088
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： William Loewenthal , Steven Alfred Miller
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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