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公开(公告)号：US09412568B2
公开(公告)日：2016-08-09
申请号：US13628093
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Francois-Charles Dary , Mark Gaydos , William Loewenthal , Steven A. Miller , Gary Rozak , Scott Jeffrey Volchko , Stefan Zimmermann , Michael Thomas Stawovy
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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Patent Agency Ranking
公开(公告)号：US20130082033A1
公开(公告)日：2013-04-04
申请号：US13628090
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Scott Jeffrey Volchko , William Loewenthal , Stefan Zimmermann , Mark Gaydos , Steven Alfred Miller
IPC: B23K31/02
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
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公开(公告)号：US20130081944A1
公开(公告)日：2013-04-04
申请号：US13628093
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Francois-Charles Dary , Mark Gaydos , William Loewenthal , Steven Alfred Miller , Gary Rozak , Scott Jeffrey Volchko , Stefan Zimmermann , Michael Thomas Stawony
IPC: C23C14/34
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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4.发明授权Methods of manufacturing large-area sputtering targets using interlocking joints 有权使用互锁接头制造大面积溅射靶的方法公开(公告)号：US09108273B2
公开(公告)日：2015-08-18
申请号：US13628090
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Scott Jeffrey Volchko , William Loewenthal , Stefan Zimmermann , Mark Gaydos , Steven Alfred Miller
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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公开(公告)号：US08703233B2
公开(公告)日：2014-04-22
申请号：US13628089
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Steven A. Miller , Francois-Charles Dary , Mark Gaydos , Gary Rozak
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, a joined sputtering target is formed by filling at least a portion of a gap between two discrete sputtering-target tiles with a gap-fill material, spray-depositing a spray material to form a partial joint, removing at least a portion of the gap-fill material, and, thereafter, spray-depositing the spray material to join the tiles.
Abstract translation: 在各种实施例中，通过将两个离散的溅射靶瓷砖之间的间隙的至少一部分填充有间隙填充材料，喷射沉积喷涂材料以形成部分接合而形成连接的溅射靶，去除至少一部分 的间隙填充材料，然后喷雾沉积喷涂材料以连接瓷砖。
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公开(公告)号：US20130081748A1
公开(公告)日：2013-04-04
申请号：US13628089
申请日：2012-09-27
Applicant: H.C. Starck, Inc.
Inventor： Steven Alfred Miller , Francois-Charles Dary , Mark Gaydos , Gary Rozak
IPC: B05D1/02
CPC classification number: H01J37/3429 , B05D1/02 , B23K31/02 , C23C14/3407 , C23C14/3414 , C23C24/04 , H01J37/3417 , H01J37/3426 , H01J2237/081 , H01J2237/332 , Y10T156/10
Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
Abstract translation: 在各种实施例中，至少部分地通过溅射材料的喷涂和/或焊接形成连接的溅射靶。
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