公开(公告)号：US11348859B2

公开(公告)日：2022-05-31

申请号：US16596100

申请日：2019-10-08

Applicant: Google LLC

Inventor： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC: H01L21/52 ,  H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/48 ,  F25B21/02 ,  H01L23/473

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

公开(公告)号：US20200273777A1

公开(公告)日：2020-08-27

申请号：US16286406

申请日：2019-02-26

Applicant: Google LLC

Inventor： Padam Jain ,  Yuan Li ,  Teckgyu Kang ,  Madhusudan Iyengar

IPC: H01L23/473 ,  H01L23/367 ,  H01L23/373 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/532 ,  H05K7/20

Abstract: A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.

公开(公告)号：US20200035583A1

公开(公告)日：2020-01-30

申请号：US16596100

申请日：2019-10-08

Applicant: Google LLC

Inventor： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC: H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/52 ,  H01L21/48 ,  F25B21/02

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

公开(公告)号：US20190074237A1

公开(公告)日：2019-03-07

申请号：US15696962

申请日：2017-09-06

Applicant: Google LLC

Inventor： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC: H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/52 ,  H01L21/48 ,  F25B21/02

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

公开(公告)号：US10964625B2

公开(公告)日：2021-03-30

申请号：US16286406

申请日：2019-02-26

Applicant: Google LLC

Inventor： Padam Jain ,  Yuan Li ,  Teckgyu Kang ,  Madhusudan Iyengar

IPC: H01L23/34 ,  H01L23/473 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/532 ,  H05K7/20

Abstract: A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.