公开(公告)号：US10007309B1

公开(公告)日：2018-06-26

申请号：US14267393

申请日：2014-05-01

Applicant: Google LLC

Inventor： Gregory Imwalle ,  David W. Stiver ,  Andrew J. Schran ,  Thomas Chris Newcomb

IPC: G06F1/20

CPC classification number: G06F1/206 ,  H05K7/20836

Abstract: An apparatus for monitoring and maintaining thermal exhaust temperatures for monitored servers may include a processor in communication with an exhaust temperature control system. The processor may implement various control loops to monitor inlet and exhaust temperatures for one or more servers, and the processor may monitor temperatures of various hardware components within those one or more servers. When the processor determines that a hardware component for a given server is overheating, the processor may take steps to decrease the temperature of the overheating hardware component for the given server. To determine whether a hardware component is overheating, the processor may leverage the hardware component's operating temperature margin.

公开(公告)号：US11348859B2

公开(公告)日：2022-05-31

申请号：US16596100

申请日：2019-10-08

Applicant: Google LLC

Inventor： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC: H01L21/52 ,  H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/48 ,  F25B21/02 ,  H01L23/473

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

公开(公告)号：US20190354151A1

公开(公告)日：2019-11-21

申请号：US16531441

申请日：2019-08-05

Applicant: Google LLC

Inventor： Gregory Imwalle ,  David W. Stiver ,  Andrew J. Schran ,  Thomas Chris Newcomb

IPC: G06F1/20

Abstract: An apparatus for monitoring and maintaining thermal exhaust temperatures for monitored servers may include a processor in communication with an exhaust temperature control system. The processor may implement various control loops to monitor inlet and exhaust temperatures for one or more servers, and the processor may monitor temperatures of various hardware components within those one or more servers. When the processor determines that a hardware component for a given server is overheating, the processor may take steps to decrease the temperature of the overheating hardware component for the given server. To determine whether a hardware component is overheating, the processor may leverage the hardware component's operating temperature margin.

公开(公告)号：US11150709B2

公开(公告)日：2021-10-19

申请号：US16531441

申请日：2019-08-05

Applicant: Google LLC

Inventor： Gregory Imwalle ,  David W. Stiver ,  Andrew J. Schran ,  Thomas Chris Newcomb

IPC: G06F1/20 ,  H05K7/20

Abstract: An apparatus for monitoring and maintaining thermal exhaust temperatures for monitored servers may include a processor in communication with an exhaust temperature control system. The processor may implement various control loops to monitor inlet and exhaust temperatures for one or more servers, and the processor may monitor temperatures of various hardware components within those one or more servers. When the processor determines that a hardware component for a given server is overheating, the processor may take steps to decrease the temperature of the overheating hardware component for the given server. To determine whether a hardware component is overheating, the processor may leverage the hardware component's operating temperature margin.

公开(公告)号：US20200035583A1

公开(公告)日：2020-01-30

申请号：US16596100

申请日：2019-10-08

Applicant: Google LLC

Inventor： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC: H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/52 ,  H01L21/48 ,  F25B21/02

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

公开(公告)号：US10429910B1

公开(公告)日：2019-10-01

申请号：US15969942

申请日：2018-05-03

Applicant: Google LLC

Inventor： Gregory Imwalle ,  David W. Stiver ,  Andrew J. Schran ,  Thomas Chris Newcomb

IPC: G06F1/20

Abstract: An apparatus for monitoring and maintaining thermal exhaust temperatures for monitored servers may include a processor in communication with an exhaust temperature control system. The processor may implement various control loops to monitor inlet and exhaust temperatures for one or more servers, and the processor may monitor temperatures of various hardware components within those one or more servers. When the processor determines that a hardware component for a given server is overheating, the processor may take steps to decrease the temperature of the overheating hardware component for the given server. To determine whether a hardware component is overheating, the processor may leverage the hardware component's operating temperature margin.

公开(公告)号：US20190074237A1

公开(公告)日：2019-03-07

申请号：US15696962

申请日：2017-09-06

Applicant: Google LLC

Inventor： Melanie Beauchemin ,  Madhusudan Iyengar ,  Christopher Malone ,  Gregory Imwalle

IPC: H01L23/38 ,  H01L25/18 ,  H01L23/053 ,  H01L23/433 ,  H01L25/00 ,  H01L21/52 ,  H01L21/48 ,  F25B21/02

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.