-
公开(公告)号：US20240120847A1
公开(公告)日：2024-04-11
申请号：US17961264
申请日：2022-10-06
Applicant: Google LLC
Inventor： Shuai Jiang , Xin Li , Woon-Seong Kwon , Cheng Chung Yang , Qiong Wang , Nam Hoon Kim , Mikhail Popovich , Houle Gan , Chenhao Nan
CPC classification number: H02M3/33576 , H02M1/0067 , H02M3/33571
Abstract: A voltage regulator having a multiple of main stages and at least one accelerated voltage regulator (AVR) bridge is provided. The main stages may respond to low frequency current transients and provide DC output voltage regulation. The AVR bridges are switched much faster than the main stages and respond to high frequency current transients without regulating the DC output voltage. The AVR bridge frequency response range can overlap with the main stage frequency response range, and the lowest frequency to which the AVR bridges respond may be set lower than the highest frequency to which the main stages respond.
-
2.发明公开公开(公告)号：US20230318456A1
公开(公告)日：2023-10-05
申请号：US17712648
申请日：2022-04-04
Applicant: Google LLC
Inventor： Chenhao Nan , Qiong Wang , Kaushik Vaidyanathan , Houle Gan , Xin Li
CPC classification number: H02M3/158 , H02M1/0009
Abstract: Controlling voltage supplied to a load includes predicting a load current transient, generating a turbo signal in response to predicting the load current transient, and increasing, in response to the turbo signal, responsiveness of a voltage regulator supplying voltage to the load.
-
公开(公告)号：US20240290763A1
公开(公告)日：2024-08-29
申请号：US18659676
申请日：2024-05-09
Applicant: Google LLC
Inventor： Houle Gan , Richard Stuart Roy , Yujeong Shim , William F. Edwards, JR. , Chenhao Nan
CPC classification number: H01L25/162 , H05K1/11 , H05K1/183 , H01L24/16 , H01L2224/16225 , H05K2201/10015 , H05K2201/1003 , H05K2201/10159 , H05K2201/10166 , H05K2201/1053 , H05K2201/10704 , H05K2201/10719
Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.
-
公开(公告)号：US20240094799A1
公开(公告)日：2024-03-21
申请号：US17894600
申请日：2022-08-24
Applicant: Google LLC
Inventor： Xiong Li , Xin Li , Qiong Wang , Kaushik Vaidyanathan , Chenhao Nan , Robert Ashby Armistead, III
IPC: G06F1/3296
CPC classification number: G06F1/3296
Abstract: The technology is generally directed to a coordinated power throttling mechanism for a payload using power provided by a rack such that the rack power does not exceed a threshold amount for greater than a predetermined period of time. The coordinated power throttling mechanism includes the rack providing a power throttling signal to the payload and the payload executing the power throttling upon detection of the throttling signal. The payload may detect the throttling signal and, after a delay, execute the power throttling. The delay may ensure that all payloads within the rack have detected the power throttling signal.
-
公开(公告)号：US20230335541A1
公开(公告)日：2023-10-19
申请号：US17719857
申请日：2022-04-13
Applicant: Google LLC
Inventor： Houle Gan , Richard Stuart Roy , Yujeong Shim , William F. Edwards, JR. , Chenhao Nan
CPC classification number: H01L25/162 , H05K1/183 , H05K1/11 , H05K2201/10719 , H05K2201/10704 , H01L24/16
Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.
-
Patent Agency Ranking
公开(公告)号：US12159738B2
公开(公告)日：2024-12-03
申请号：US17358354
申请日：2021-06-25
Applicant: Google LLC
Inventor： Chenhao Nan , Houle Gan , Runruo Chen , Qiong Wang , Xin Li
Abstract: The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.
-
公开(公告)号：US20240396447A1
公开(公告)日：2024-11-28
申请号：US18200392
申请日：2023-05-22
Applicant: Google LLC
Inventor： Shuai Jiang , Chenhao Nan , Houle Gan , Qiong Wang
Abstract: The subject matter described herein provides systems and techniques for the integration of Trans-Induction Voltage regulator (TLVR) technology in a vertical power Voltage Regulator (VR) module. The capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. In some instances, output capacitors may be integrated into components of the structures to provide adequate operational capacitance previously provided by the output capacitance board. Example structures may also include a controller.
-
公开(公告)号：US20220415558A1
公开(公告)日：2022-12-29
申请号：US17358354
申请日：2021-06-25
Applicant: Google LLC
Inventor： Chenhao Nan , Houle Gan , Runruo Chen , Qiong Wang , Xin Li
Abstract: The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.
-
公开(公告)号：US12242326B2
公开(公告)日：2025-03-04
申请号：US17894600
申请日：2022-08-24
Applicant: Google LLC
Inventor： Xiong Li , Xin Li , Qiong Wang , Kaushik Vaidyanathan , Chenhao Nan , Robert Ashby Armistead, III
IPC: G06F1/32 , G06F1/3296
Abstract: The technology is generally directed to a coordinated power throttling mechanism for a payload using power provided by a rack such that the rack power does not exceed a threshold amount for greater than a predetermined period of time. The coordinated power throttling mechanism includes the rack providing a power throttling signal to the payload and the payload executing the power throttling upon detection of the throttling signal. The payload may detect the throttling signal and, after a delay, execute the power throttling. The delay may ensure that all payloads within the rack have detected the power throttling signal.
-
公开(公告)号：US20240395453A1
公开(公告)日：2024-11-28
申请号：US18798347
申请日：2024-08-08
Applicant: Google LLC
Inventor： Chenhao Nan , Houle Gan , Runruo Chen , Qiong Wang , Xin Li
Abstract: The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.013 seconds)
