公开(公告)号：US10233075B2

公开(公告)日：2019-03-19

申请号：US15739913

申请日：2017-03-03

Applicant: Goertek Inc.

Inventor： Junkai Zhan ,  Zonglin Zhou ,  Guanxun Qiu ,  Mengjin Cai

IPC: B81B7/00 ,  B81C1/00 ,  B81C3/00

Abstract: A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

公开(公告)号：US10349187B2

公开(公告)日：2019-07-09

申请号：US15781364

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： Junkai Zhan ,  Mengjin Cai ,  Guanxun Qiu ,  Zonglin Zhou ,  Qinglin Song

IPC: H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  B81B7/00 ,  B81C1/00 ,  B81B7/02

Abstract: An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.

公开(公告)号：US11363384B2

公开(公告)日：2022-06-14

申请号：US16760816

申请日：2018-09-06

Applicant: Goertek, Inc.

Inventor： Maoqiang Dang ,  Guanxun Qiu ,  Mengjin Cai

IPC: H04R7/06

Abstract: The present disclosure discloses a sensitive diaphragm comprising a diaphragm body, an edge region of the diaphragm body being provided with a rim structure, wherein the rim structure is in a non-closed annular shape, a non-closed region is located at a part not closed by the rim structure, and the non-closed region are integral and continuous with parts of the diaphragm body adjacent to the rim structure. According to the sensitive diaphragm of the present disclosure, the annular rim structure is separated by the non-closed region.

公开(公告)号：US20180362331A1

公开(公告)日：2018-12-20

申请号：US15739913

申请日：2017-03-03

Applicant: Goertek Inc.

Inventor： Junkai ZHAN ,  Zonglin ZHOU ,  Guanxun Qiu ,  Mengjin CAI

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0058 ,  B81B2201/02 ,  B81C1/00261 ,  B81C3/001

Abstract: A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

公开(公告)号：US09866971B2

公开(公告)日：2018-01-09

申请号：US15305089

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo Zou ,  Zhe Wang ,  Jifang Tao ,  Guanxun Qiu

IPC: H04R25/00 ,  H04R19/02 ,  H04R7/06 ,  H04R31/00 ,  H04R19/01 ,  B81B7/00 ,  B81C1/00

CPC classification number: H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

Abstract: The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.