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公开(公告)号：US20130164445A1
公开(公告)日：2013-06-27
申请号：US13720301
申请日：2012-12-19
Applicant: Garry K. Kwong , Joseph Yudovsky , Steven D. Marcus
Inventor： Garry K. Kwong , Joseph Yudovsky , Steven D. Marcus
IPC: C23C16/448
CPC classification number: C23C16/448 , C23C16/44 , C23C16/45551 , C23C16/45563 , C23C16/45574
Abstract: Provided are assemblies comprising an elongate enclosure comprising a material resistant to thermal expansion at temperatures experienced in a processing chamber. At least one heating element extends along a longitudinal axis of the elongate enclosure through an open interior region allowing a flow of gases to pass the heating element in a direction substantially perpendicular to the longitudinal axis. Methods of processing substrates using a heating element to excite gaseous precursor species are also described.
Abstract translation: 提供了包括细长外壳的组件，其包括在处理室中经历的温度下耐受热膨胀的材料。 至少一个加热元件沿着细长外壳的纵向轴线延伸穿过开放的内部区域，允许气体流沿基本上垂直于纵向轴线的方向通过加热元件。 还描述了使用加热元件处理衬底以激发气态前体物质的方法。
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公开(公告)号：US20130143415A1
公开(公告)日：2013-06-06
申请号：US13308849
申请日：2011-12-01
Applicant: Joseph Yudovsky , Mei Chang , Steven D. Marcus , Garry K. Kwong
Inventor： Joseph Yudovsky , Mei Chang , Steven D. Marcus , Garry K. Kwong
IPC: H01L21/31 , B67D7/06 , C23C16/455
CPC classification number: C23C16/45551
Abstract: Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising a plurality of elongate gas ports including at least one first reactive gas port in fluid communication with a first reactive gas and at least one second reactive gas port in fluid communication with a gas manifold. The gas manifold is in fluid communication with at least a second reactive gas different from the first reactive gas and a purge gas. Also provided are atomic layer deposition apparatus and methods including linear energy sources in one or more of region before the gas distribution plate and a region after the gas distribution plate.
Abstract translation: 提供的是原子层沉积装置和方法，其包括气体分配板，其包括多个细长气体端口，该多个细长气体端口包括与第一反应气体流体连通的至少一个第一反应气体端口和与气体流体连通的至少一个第二反应气体端口 多数。 气体歧管与不同于第一反应气体和吹扫气体的至少第二反应气体流体连通。 还提供了原子层沉积装置和方法，其包括在气体分配板之前的区域中的一个或多个区域和气体分配板之后的区域中的线性能量源。
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公开(公告)号：US20120269967A1
公开(公告)日：2012-10-25
申请号：US13437567
申请日：2012-04-02
Applicant: Joseph Yudovsky , Garry K. Kwong , Dieter Haas , Steven D. Marcus , Timothy W. Weidman
Inventor： Joseph Yudovsky , Garry K. Kwong , Dieter Haas , Steven D. Marcus , Timothy W. Weidman
IPC: C23C16/455 , B05B1/14
CPC classification number: C23C16/45551 , C23C16/452 , C23C16/45544
Abstract: Provided are gas distribution plates for atomic layer deposition apparatus including a hot wire or hot wire unit which can be heated to excite gaseous species while processing a substrate. Methods of processing substrates using a hot wire to excite gaseous precursor species are also described.
Abstract translation: 提供了用于原子层沉积设备的气体分配板，其包括热线或热丝单元，其可以在加工基板的同时被加热以激发气态物质。 还描述了使用热丝处理衬底以激发气态前体物质的方法。
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4.发明授权Elongated capacitively coupled plasma source for high temperature low pressure environments 有权用于高温低压环境的细长电容耦合等离子体源公开(公告)号：US09355819B2
公开(公告)日：2016-05-31
申请号：US14460683
申请日：2014-08-15
Applicant: John C. Forster , Joseph Yudovsky , Garry K. Kwong , Tai T. Ngo , Kevin Griffin , Kenneth S. Collins , Ren Liu
Inventor： John C. Forster , Joseph Yudovsky , Garry K. Kwong , Tai T. Ngo , Kevin Griffin , Kenneth S. Collins , Ren Liu
IPC: H01J37/32
CPC classification number: H01J37/32091 , H01J37/32357 , H01J37/32513 , H01J37/32541 , H01J37/32568
Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.
Abstract translation: 描述了与处理室一起使用的模块化等离子体源组件。 该组件包括具有端电介质的RF热电极和邻近电极侧面定位的滑动接地连接。 密封箔将滑动接地连接到壳体，以提供通过端部电介质与热电极分离的接地滑动接地连接。 同轴馈电线通过导管进入与处理环境隔离的RF热电极，使得同轴RF馈电线处于大气压力，同时等离子体处理区域处于减压状态。
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公开(公告)号：US20160068958A1
公开(公告)日：2016-03-10
申请号：US14785009
申请日：2014-04-10
Applicant: Umesh M KELKAR , Kallol BERA , Karthik RAMANATHAN , Garry K KWONG , Joseph YUDOVSKY , Applied Materials, Inc.
Inventor： Umesh M. Kelkar , Kallol Bera , Karthik Ramanathan , Garry K Kwong , Joseph Yudovsky
IPC: C23C16/46 , C23C16/458 , C23C16/455
CPC classification number: C23C16/46 , C23C16/45544 , C23C16/4584 , C23C16/481 , C23C16/52 , H01L21/67115
Abstract: Apparatus and methods for processing a plurality of semiconductor wafers on a susceptor assembly so that the temperature across the susceptor assembly is uniform are described. A plurality of linear lamps are positioned and controlled in zones to provide uniform heating.
Abstract translation: 描述了在基座组件上处理多个半导体晶片的装置和方法，使得基座组件上的温度是均匀的。 多个线性灯被定位和控制在区域中以提供均匀的加热。
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Patent Agency Ranking
公开(公告)号：US20120225192A1
公开(公告)日：2012-09-06
申请号：US13189692
申请日：2011-07-25
Applicant: Joseph Yudovsky , Garry K. Kwong , Mei Chang , Anh N. Nguyen , David Thompson
Inventor： Joseph Yudovsky , Garry K. Kwong , Mei Chang , Anh N. Nguyen , David Thompson
IPC: C23C16/458 , B05D5/12
CPC classification number: C23C16/45551 , C23C16/45527
Abstract: Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising at least one gas injector unit. Each gas injector unit comprises a plurality of elongate gas injectors including at least two first reactive gas injectors and at least one second reactive gas injector, the at least two first reactive gas injectors surrounding the at least one second reactive gas injector. Also provided are atomic layer deposition apparatuses and methods including a gas distribution plate with a plurality of gas injector units.
Abstract translation: 提供的原子层沉积装置和方法包括包括至少一个气体注入单元的气体分配板。 每个气体喷射器单元包括多个细长的气体喷射器，其包括至少两个第一反应气体喷射器和至少一个第二反应气体喷射器，所述至少两个第一反应气体喷射器围绕至少一个第二反应气体喷射器。 还提供了包括具有多个气体喷射器单元的气体分配板的原子层沉积设备和方法。
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公开(公告)号：US20120225191A1
公开(公告)日：2012-09-06
申请号：US13037992
申请日：2011-03-01
Applicant: Joseph Yudovsky , Garry K. Kwong , Mei Chang , Anh N. Nguyen , David Thompson
Inventor： Joseph Yudovsky , Garry K. Kwong , Mei Chang , Anh N. Nguyen , David Thompson
IPC: C23C16/455 , B05D5/12
CPC classification number: C23C16/45551 , C23C16/45527
Abstract: Provided are atomic layer deposition apparatus and methods including a gas distribution plate comprising at least one gas injector unit. Each gas injector unit comprises a plurality of elongate gas injectors including at least two first reactive gas injectors and at least one second reactive gas injector, the at least two first reactive gas injectors surrounding the at least one second reactive gas injector. Also provided are atomic layer deposition apparatuses and methods including a gas distribution plate with a plurality of gas injector units.
Abstract translation: 提供的原子层沉积装置和方法包括包括至少一个气体注入单元的气体分配板。 每个气体喷射器单元包括多个细长的气体喷射器，其包括至少两个第一反应气体喷射器和至少一个第二反应气体喷射器，所述至少两个第一反应气体喷射器围绕至少一个第二反应气体喷射器。 还提供了包括具有多个气体喷射器单元的气体分配板的原子层沉积设备和方法。
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8.发明申请公开(公告)号：US20150048739A1
公开(公告)日：2015-02-19
申请号：US14460683
申请日：2014-08-15
Applicant: John C. Forster , Joseph Yudovsky , Garry K. Kwong , Tai T. Ngo , Kevin Griffin , Kenneth S. Collins , Ren Liu
Inventor： John C. Forster , Joseph Yudovsky , Garry K. Kwong , Tai T. Ngo , Kevin Griffin , Kenneth S. Collins , Ren Liu
IPC: H01J37/32
CPC classification number: H01J37/32091 , H01J37/32357 , H01J37/32513 , H01J37/32541 , H01J37/32568
Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.
Abstract translation: 描述了与处理室一起使用的模块化等离子体源组件。 该组件包括具有端电介质的RF热电极和邻近电极侧面定位的滑动接地连接。 密封箔将滑动接地连接到壳体，以提供通过端部电介质与热电极分离的接地滑动接地连接。 同轴馈电线通过导管进入与处理环境隔离的RF热电极，使得同轴RF馈电线处于大气压力，同时等离子体处理区域处于减压状态。
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公开(公告)号：US20130019960A1
公开(公告)日：2013-01-24
申请号：US13554487
申请日：2012-07-20
Applicant: Kenric Choi , Joseph Yudovsky , Steven D. Marcus , Ernesto Ulloa
Inventor： Kenric Choi , Joseph Yudovsky , Steven D. Marcus , Ernesto Ulloa
CPC classification number: C23C16/4408 , C23C16/4481 , Y10T137/6416 , Y10T137/86911
Abstract: Provided are apparatus and methods for generating a chemical precursor. The apparatus comprises an inlet line to be connected to an ampoule and an outlet line to be connected to an ampoule. The inlet line having an inlet valve to control the flow of a carrier gas into the ampoule and the outlet line has an outlet valve to control the flow exiting the ampoule. A bypass valve allows carrier gas to bypass the ampoule and purge the outlet valve without flowing gas into the ampoule.
Abstract translation: 提供了用于产生化学前体的装置和方法。 该装置包括要连接到安瓿的入口管线和要连接到安瓿的出口管线。 入口管线具有用于控制载气进入安瓿和出口管线的入口阀，其具有出口阀以控制离开安瓿的流量。 旁通阀允许载气旁路安瓿并吹扫出口阀，而不会使气体流入安瓿。
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公开(公告)号：US20160027675A1
公开(公告)日：2016-01-28
申请号：US14774377
申请日：2014-03-14
Applicant: Abraham RAVID , Kevin GRIFFIN , Joseph YUDOVSKY , Kaushal GANGAKHEDKAR , Dmitry A. DZILNO , Alex MINKOVICH
Inventor： Abraham Ravid , Kevin Griffin , Joseph Yudovsky , Kaushal Gangakhedkar , Dmitry A. Dzilno , Alex Minkovich
IPC: H01L21/67 , C23C16/458 , C23C16/52 , H01L21/687 , C23C16/455
CPC classification number: H01L21/67259 , C23C16/45544 , C23C16/4584 , C23C16/52 , H01L21/67248 , H01L21/68764 , H01L21/68771
Abstract: Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.
Abstract translation: 描述了测量和控制基座组件和气体分配组件之间的间隙的装置和方法。 还描述了用于晶片转印目的的位置控制和温度控制的装置和方法。
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