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公开(公告)号：US20180209752A1
公开(公告)日：2018-07-26
申请号：US15924326
申请日：2018-03-19
IPC分类号： F28G15/00 , F28F27/00 , H01L23/467 , G06F1/20 , F28D21/00 , F28D1/04 , F28D1/02 , F04D19/00 , B60K11/08
CPC分类号： F28G15/003 , B60K11/02 , B60K11/08 , F04D19/002 , F04D25/068 , F04D25/166 , F28D1/024 , F28D1/04 , F28D2021/0031 , F28D2021/008 , F28D2021/0091 , F28F27/00 , G06F1/20 , G06F1/206 , H01L23/467
摘要： A method for monitoring that includes the steps of: associating a monitoring module with a heat exchanger unit; operating the monitoring module whereby a microcontroller performs various tasks, and ultimately providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the cooling side. The module also includes a logic circuit having a microcontroller in operable communication with the at least one sensor.
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公开(公告)号：US20170294366A1
公开(公告)日：2017-10-12
申请号：US15591086
申请日：2017-05-09
IPC分类号： H01L23/467 , G06F1/20
CPC分类号： F28G15/003 , B60K11/02 , B60K11/08 , F04D19/002 , F04D25/068 , F04D25/166 , F28D1/024 , F28D1/04 , F28D2021/0031 , F28D2021/008 , F28D2021/0091 , F28F27/00 , G06F1/20 , G06F1/206 , H01L23/467
摘要： Embodiments of the disclosure pertain to a method for monitoring a heat exchanger unit that may include the steps of: coupling the heat exchanger unit with a heat generating device; associating a monitoring module with an airflow side of the heat exchanger unit; operating the monitoring module whereby a microcontroller performs tasks related to providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the airflow side; a logic circuit in operable communication with the at least one sensor, and further comprising the microcontroller.
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公开(公告)号：US20180003532A1
公开(公告)日：2018-01-04
申请号：US15705024
申请日：2017-09-14
摘要： A sensor assembly that includes a mounting frame; and a support platform coupled with the mounting frame. The support platform has a top platform surface with a circuit board disposed thereon. The circuit board is operably configured with a secondary microcontroller and a Hall effect sensor. There is an inner sensor housing configured to extend out and around the circuit board and the support platform. There is a first magnet coupled to an underside of the inner sensor housing. There is a rotating member configured with a plurality of blades and a rotating member mounting ring, the rotating member is proximately disposed on top of the inner sensor housing.
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公开(公告)号：US20170294103A1
公开(公告)日：2017-10-12
申请号：US15591089
申请日：2017-05-09
摘要： Embodiments of the disclosure pertain to a method of doing business that includes entering into a transaction with a first recipient; per terms of the transaction, providing a monitoring module for a heat exchanger unit; operably associating the monitoring module with the heat exchanger unit, the monitoring module being configured and operable to monitor a fouling condition of the heat exchanger unit; providing information about an indication received from the monitoring module related to the fouling condition; and performing a cleaning action of the heat exchanger unit upon based on the indication.
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公开(公告)号：US10533814B2
公开(公告)日：2020-01-14
申请号：US15924326
申请日：2018-03-19
IPC分类号： F28G15/00 , F28F27/00 , B60K11/08 , F04D19/00 , G06F1/20 , H01L23/467 , F28D21/00 , F28D1/04 , F28D1/02
摘要： A method for monitoring that includes the steps of: associating a monitoring module with a heat exchanger unit; operating the monitoring module whereby a microcontroller performs various tasks, and ultimately providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the cooling side. The module also includes a logic circuit having a microcontroller in operable communication with the at least one sensor.
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公开(公告)号：US10416008B2
公开(公告)日：2019-09-17
申请号：US15616224
申请日：2017-06-07
IPC分类号： F01M5/00 , G01F1/05 , F28F27/00 , F28F19/00 , F01P1/06 , F24F11/30 , F24F11/52 , F01P5/06 , F01P11/10
摘要： Embodiments of the disclosure pertain to a monitored heat exchanger system that includes a heat exchanger unit in operable engagement with a heat generating device. The heat exchanger unit has a frame; and at least one cooler coupled with the frame, the at least one cooler having an airflow side and a service fluid side. The system includes a monitoring module coupled to the heat exchanger unit. The monitoring module an at least one sensor; and at least one controller housing. A microcontroller is disposed within the controller housing and in operable communication with the at least one sensor. The at least one sensor has a rotating member configured to generate a system signal proportional to an amount of rotation of the rotating member.
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公开(公告)号：US10545002B2
公开(公告)日：2020-01-28
申请号：US15591086
申请日：2017-05-09
IPC分类号： F28G15/00 , F28F27/00 , B60K11/08 , F04D19/00 , G06F1/20 , H01L23/467 , F28D21/00 , F28D1/04 , F28D1/02
摘要： Embodiments of the disclosure pertain to a method for monitoring a heat exchanger unit that may include the steps of: coupling the heat exchanger unit with a heat generating device; associating a monitoring module with an airflow side of the heat exchanger unit; operating the monitoring module whereby a microcontroller performs tasks related to providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the airflow side; a logic circuit in operable communication with the at least one sensor, and further comprising the microcontroller.
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公开(公告)号：US09970720B2
公开(公告)日：2018-05-15
申请号：US15616153
申请日：2017-06-07
IPC分类号： F22B37/00 , F28G15/00 , F28F27/00 , H01L23/467 , B60K11/08 , F04D19/00 , G06F1/20 , F28D21/00 , F28D1/04 , F28D1/02
CPC分类号： F28G15/003 , B60K11/08 , F04D19/002 , F04D25/068 , F04D25/166 , F28D1/024 , F28D1/04 , F28D2021/0031 , F28D2021/008 , F28D2021/0091 , F28F27/00 , G06F1/20 , G06F1/206 , H01L23/467
摘要： Embodiments of the disclosure pertain to a method for monitoring a heat exchanger unit that may include the steps of: associating a monitoring module with an airflow side of the heat exchanger unit; operating the monitoring module whereby a microcontroller performs tasks related to data acquisition, data comparison, and providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the airflow side; a logic circuit in operable communication with the at least one sensor, and further comprising the microcontroller.
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公开(公告)号：US09945578B2
公开(公告)日：2018-04-17
申请号：US15719099
申请日：2017-09-28
CPC分类号： G01F1/115 , F01P1/06 , F01P2025/00 , F24D19/10 , F24F11/30 , F24F11/52 , F24F11/62 , F24F11/63 , F24F11/64 , F24F11/89 , F24F2110/00 , F24H9/20 , F28F19/00 , F28F27/00
摘要： A monitored heat exchanger system that includes a heat exchanger unit in operable engagement with a heat generating device, with an at least one service fluid being transferable therebetween, and a monitoring module coupled to the heat exchanger unit. The monitoring module includes a primary microcontroller in operable communication with an at least one sensor assembly. The at least one sensor assembly includes a mounting frame; a support platform; a circuit board; an inner sensor housing configured to extend out and around the circuit board and the support platform; a first magnet coupled to an underside of the inner sensor housing; and a rotating member comprising a plurality of blades, the rotating member being disposed on top of the inner sensor housing.
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公开(公告)号：US20170292803A1
公开(公告)日：2017-10-12
申请号：US15616153
申请日：2017-06-07
CPC分类号： F28G15/003 , B60K11/08 , F04D19/002 , F04D25/068 , F04D25/166 , F28D1/024 , F28D1/04 , F28D2021/0031 , F28D2021/008 , F28D2021/0091 , F28F27/00 , G06F1/20 , G06F1/206 , H01L23/467
摘要： Embodiments of the disclosure pertain to a method for monitoring a heat exchanger unit that may include the steps of: associating a monitoring module with an airflow side of the heat exchanger unit; operating the monitoring module whereby a microcontroller performs tasks related to data acquisition, data comparison, and providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the airflow side; a logic circuit in operable communication with the at least one sensor, and further comprising the microcontroller.
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