-
公开(公告)号：US20150109738A1
公开(公告)日：2015-04-23
申请号：US14525780
申请日：2014-10-28
CPC分类号： H05K7/20509 , H01L23/3121 , H01L23/4006 , H01L23/4334 , H01L23/49811 , H01L25/115 , H01L25/18 , H01L2224/01 , H01L2924/0002 , H05K7/02 , H01L2924/00
摘要： A semiconductor device has a single unit capable of improving adhesion to a cooling body and a heat dissipation performance, and an aggregate of the single units is capable of configuring any circuit at a low cost. A single unit includes copper blocks, an insulating substrate with a conductive pattern, an IGBT chip, a diode chip, a collector terminal pin, implant pins fixed to the chips by solder, a printed circuit board having the implant pins fixed thereto, an emitter terminal pin, a control terminal pin, a collector terminal pin, and a resin case having the above-mentioned components sealed therein. The copper blocks make it possible to improve adhesion to a cooling body and the heat dissipation performance. A plurality of single units can be combined with an inter-unit wiring board to form any circuit.
摘要翻译： 半导体器件具有能够改善与冷却体的粘附性和散热性能的单个单元，并且单个单元的聚集体能够以低成本构成任何电路。 单个单元包括铜块，具有导电图案的绝缘衬底，IGBT芯片，二极管芯片，集电极端子引脚，通过焊料固定到芯片的注入引脚，具有固定到其上的注入引脚的印刷电路板，发射器 端子销，控制端子销，集电极端子销和具有密封在其中的上述部件的树脂壳体。 铜块使得可以提高对冷却体的粘附性和散热性能。 多个单个单元可以与单元间布线板组合以形成任何电路。
-
公开(公告)号：US20150380335A1
公开(公告)日：2015-12-31
申请号：US14848171
申请日：2015-09-08
CPC分类号： H01L23/295 , H01L23/28 , H01L23/293 , H01L23/3135 , H01L24/01 , H01L25/07 , H01L25/18 , H01L29/1608 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.
摘要翻译： 半导体器件包括通过密封材料密封包括半导体元件的元件，与半导体元件的一个表面接合的绝缘基板和用于连接到半导体元件的印刷电路板而获得的成型体 外部电路并且结合到半导体元件的另一表面。 密封材料包括第一密封材料，其是包含环氧基树脂，固化剂和平均粒度为1nm至100nm的无机填料的纳米复合树脂; 以及第二密封材料，其为不含无机填料的热固性树脂，热塑性树脂或其混合物。 即使当半导体元件在175℃以上的高温下工作时，密封材料也不太可能被热氧化而劣化，具有抗裂性，并且具有高的可靠性和耐久性。
-
搜索结果
2 条记录 (耗时 0.012 秒)
