公开(公告)号：US20230308074A1

公开(公告)日：2023-09-28

申请号：US18247629

申请日：2021-09-29

Applicant: FREC'N'SYS

Inventor： Sylvain Ballandras ,  Emilie Courjon ,  Florent Bernard ,  Thierry LaRoche ,  Julien Garcia ,  Alexandre Clairet

IPC: H03H9/02

CPC classification number: H03H9/02574 ,  H03H9/02559 ,  H03H9/0259 ,  H03H9/14538

Abstract: A surface acoustic wave (SAW) device comprises an interdigitated transducer structure and at least one acoustic wave reflective structure provided on or in an acoustic wave propagating substrate. The interdigitated transducer structure comprises a first material and the at least one acoustic wave reflective structure comprises a second material different from the first material and/or the acoustic wave reflective structure and the interdigitated transducer structure have different geometrical parameters. A sensor comprises a SAW device as described herein, and a method is used for manufacturing a SAW device comprising at least one acoustic wave reflective structure.