MICROSCOPY FEEDBACK FOR IMPROVED MILLING ACCURACY

    公开(公告)号:US20230197403A1

    公开(公告)日:2023-06-22

    申请号:US17873532

    申请日:2022-07-26

    申请人: FEI Company

    摘要: Methods and apparatus are disclosed for integration of image-based metrology into a milling workflow. A first ion beam milling operation is performed to an edge at a distance from a final target position on a sample. An SEM image of the sample is used to determine a distance between the milled edge and a reference structure on the sample. Based on the determined distance, the ion beam is adjusted to perform a second milling operation to shift the milled edge to the final target position. Extensions to iterative procedures are disclosed. Various geometric configurations and corrections are disclosed. Manufacturing and analytic applications are disclosed in a variety of fields, including read-write head manufacture and TEM sample preparation. Other combinations of imaging and milling tools can be used.