公开(公告)号：US09359693B2

公开(公告)日：2016-06-07

申请号：US13781054

申请日：2013-02-28

申请人： Element Six Technologies US Corporation

发明人： Daniel Francis ,  Firooz Faili ,  Kristopher Matthews ,  Frank Yantis Lowe ,  Quentin Diduck ,  Sergey Zaytsev ,  Felix Ejeckam

IPC分类号： C30B25/16 ,  C30B25/10 ,  C30B25/18 ,  C30B25/20 ,  C30B29/04 ,  H01L21/02 ,  C23C16/27 ,  C23C16/46 ,  H01L29/20 ,  H01L29/778 ,  H01L21/18

CPC分类号： C30B25/16 ,  C23C16/271 ,  C23C16/463 ,  C30B25/10 ,  C30B25/18 ,  C30B25/183 ,  C30B25/205 ,  C30B29/04 ,  H01L21/02381 ,  H01L21/02389 ,  H01L21/0245 ,  H01L21/02488 ,  H01L21/02527 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02658 ,  H01L21/187 ,  H01L29/2003 ,  H01L29/7786

摘要： A method for integrating wide-gap semiconductors, and specifically, gallium nitride epilayers, with synthetic diamond substrates is disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure that comprises at least one layer of gallium nitride. Methods for manufacturing GaN-on-diamond wafers with low bow and high crystalline quality are disclosed along with preferred choices for manufacturing GaN-on-diamond wafers and chips tailored to specific applications.

摘要翻译： 公开了一种用于将宽间隙半导体，特别是氮化镓外延层与合成金刚石衬底集成的方法。 通过将沉积合成金刚石沉积到沉积或形成在包括至少一层氮化镓的层状结构上的成核层上而形成金刚石基底。 公开了用于制造具有低弓形和高结晶质量的GaN-金刚石晶片的方法以及针对特定应用定制的用于制造在金刚石GaN晶片和芯片上的优选选择。

公开(公告)号：US20150200254A1

公开(公告)日：2015-07-16

申请号：US14409867

申请日：2013-07-02

申请人： Element Six Technologies US Corporation

发明人： Quentin Diduck ,  Daniel Francis ,  Frank Yantis Lowe ,  Felix Ejeckham

IPC分类号： H01L29/16 ,  H01L29/165 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L29/1602 ,  H01L21/02002 ,  H01L21/2007 ,  H01L21/6835 ,  H01L23/3732 ,  H01L24/29 ,  H01L24/98 ,  H01L29/165 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2924/0002 ,  Y10T428/24355 ,  H01L2924/00011

摘要： Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.

摘要翻译： 公开了将薄和/或弯曲的金刚石半导体晶片（401）安装和拆卸到载体（407）的方法，其使所述晶片平坦化并提供机械支撑以使得能够在所述金刚石半导体晶片上实现有效的半导体器件处理。