发明申请
US20150200254A1 HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE
有权
半导体在金刚砂表面的手柄及其制造方法
- 专利标题： HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE
- 专利标题（中）： 半导体在金刚砂表面的手柄及其制造方法
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申请号： US14409867申请日： 2013-07-02
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公开(公告)号： US20150200254A1公开(公告)日： 2015-07-16
- 发明人: Quentin Diduck , Daniel Francis , Frank Yantis Lowe , Felix Ejeckham
- 申请人： Element Six Technologies US Corporation
- 国际申请： PCT/IB13/55417 WO 20130702
- 主分类号： H01L29/16
- IPC分类号： H01L29/16 ; H01L29/165 ; H01L21/683 ; H01L23/00
摘要：
Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers (401) to a carrier (407) are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.
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