公开(公告)号：US20210381099A1

公开(公告)日：2021-12-09

申请号：US17287702

申请日：2019-10-22

申请人： EVATEC AG

发明人： Dominik Jaeger ,  Thomas Tschirky ,  Marco Rechsteiner ,  Heinz Felzer ,  Hartmut Rohrmann

IPC分类号： C23C14/34 ,  C23C14/54 ,  C23C14/35 ,  H01J37/34

摘要： A sputtering device to sputter a liquid target. The sputtering device including a trough to receive a liquid target material and a device to stir or agitate the liquid target material. The device configured to degas the liquid target material or/and to dissipate solid particles or islands on a surface of the target or/and to move such particles or islands from an active surface region to a passive surface region and/or vice-versa, whereby the passive surface region is at least 50% less exposed to sputtering as the active surface region.

公开(公告)号：US11952654B2

公开(公告)日：2024-04-09

申请号：US17287702

申请日：2019-10-22

申请人： EVATEC AG

发明人： Dominik Jaeger ,  Thomas Tschirky ,  Marco Rechsteiner ,  Heinz Felzer ,  Hartmut Rohrmann

IPC分类号： C23C14/34 ,  C23C14/35 ,  C23C14/54 ,  H01J37/34

CPC分类号： C23C14/3428 ,  C23C14/35 ,  C23C14/54 ,  H01J37/3405 ,  H01J37/3426 ,  H01J37/3435 ,  H01J37/3438 ,  H01J37/3441 ,  H01J2237/332

摘要： A sputtering device to sputter a liquid target. The sputtering device including a trough to receive a liquid target material and a device to stir or agitate the liquid target material. The device configured to degas the liquid target material or/and to dissipate solid particles or islands on a surface of the target or/and to move such particles or islands from an active surface region to a passive surface region and/or vice-versa, whereby the passive surface region is at least 50% less exposed to sputtering as the active surface region.