- 专利标题: Liquid sputter target
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申请号: US17287702申请日: 2019-10-22
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公开(公告)号: US11952654B2公开(公告)日: 2024-04-09
- 发明人: Dominik Jaeger , Thomas Tschirky , Marco Rechsteiner , Heinz Felzer , Hartmut Rohrmann
- 申请人: EVATEC AG
- 申请人地址: CH Trübbach
- 专利权人: EVATEC AG
- 当前专利权人: EVATEC AG
- 当前专利权人地址: CH Trübbach
- 代理机构: Pearne & Gordon LLP
- 优先权: CH 29818 2018.10.24
- 国际申请: PCT/EP2019/078675 2019.10.22
- 国际公布: WO2020/083882A 2020.04.30
- 进入国家日期: 2021-04-22
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; C23C14/35 ; C23C14/54 ; H01J37/34
摘要:
A sputtering device to sputter a liquid target. The sputtering device including a trough to receive a liquid target material and a device to stir or agitate the liquid target material. The device configured to degas the liquid target material or/and to dissipate solid particles or islands on a surface of the target or/and to move such particles or islands from an active surface region to a passive surface region and/or vice-versa, whereby the passive surface region is at least 50% less exposed to sputtering as the active surface region.
公开/授权文献
- US20210381099A1 LIQUID SPUTTER TARGET 公开/授权日:2021-12-09
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